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  1. Ethernet
    ETHERNET≥2
  2. Operating Temperature
    -40°C ÷ +85°C
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Cpu Maker
  1. AMD 3 items
  2. Arm System ready NXP 1 item
  3. Intel 10 items
  4. MediaTek 1 item
  5. NXP 8 items
  6. Qualcomm 2 items
Cpu Power Consumption
  1. range 10-25 W 7 items
  2. range < 10 W 9 items
  3. range < 5 W 1 item
  4. range > 25 W 2 items
Cpu Type
  1. AMD EPYC™ Embedded 3 1 item
  2. AMD Ryzen™ Embedded 1 item
  3. AMD® Ryzen™ embedded 1 item
  4. Intel® Atom™ 7 items
  5. Intel® Celeron® 7 items
  6. Intel® Core™ 3 items
  7. Intel® Pentium® 5 items
  8. NXP i.MX 8M Mini 1 item
  9. NXP i.MX 8M Plus 2 items
  10. NXP i.MX 8X 2 items
  11. NXP i.MX 933/935 1 item
  12. NXP i.MX 95 1 item
  13. NXP i.MX8 1 item
  14. Zynq® Ultras 1 item
  15. Qualcomm Dragonwing IQ-X 1 item
  16. MediaTek Genio360 1 item
  17. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 48 items
  2. ETHERNET≥2 29 items
Form Factor
  1. COM Express® 2 items
  2. COM-HPC® 3 items
  3. SMARC 12 items
  4. Trizeps SODIMM SOM 2 items
  5. Single Board Computer 9 items
Form Factor Dimensions
  1. 67,6 x 36,7 mm 2 items
  2. ≤ 100 x 100mm 12 items
  3. ≤ 80 x 80mm 7 items
  4. ≥ 100 x 100mm 7 items
  5. COM Express® 1 item
Form Factor Specification
  1. 3,5" 5 items
  2. COM Express Basic 1 item
  3. COM-HPC Client 2 items
  4. embedded NUC 1 item
  5. Pico-ITX 3 items
  6. ≤ 100 x 100mm 1 item
Memory
  1. memory ≤1 18 items
  2. memory ≤16 8 items
  3. memory ≤2 19 items
  4. memory ≤4 18 items
  5. memory ≤8 13 items
  6. memory ≥32 4 items
  7. soldered down 14 items
  8. SO_DIMM 5 items
  9. memory ≤32 1 item
  10. I2C EEPROM 1 item
  11. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 item
Mass Storage
  1. onboard SSD 2 items
  2. standard SATA connector 3 items
  3. I2C EEPROM 1 item
  4. M.2 NVMe SSD slot 4 items
  5. M.2 SATA SSD slot 8 items
  6. microSD card slot 6 items
  7. onboard eMMC 13 items
  8. onboard eMMC 3 items
  9. SATA channels ≥ 1 9 items
  10. SATA channels ≥ 1 1 item
  11. SATA channels ≥ 2 3 items
  12. SATA channels ≥ 2 3 items
  13. SD interface 5 items
  14. SD interface 3 items
  15. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 item
  16. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 21 items
  2. -20°C ÷ +70°C 2 items
  3. -40°C ÷ +85°C 29 items
  4. 0°C ÷ +50°C 32 items
  5. 0°C ÷ +60°C 40 items
  6. 20°C ÷ +70°C 20 items
  7. -20°C ÷ +70°C 6 items
  8. -20°C ÷ +70°C 1 item
  9. -40°C ÷ +60°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 15 items
  2. PCI-e lanes ≥ 2 12 items
  3. PCI-e lanes ≥ 3 8 items
  4. PCI-e lanes ≥ 4 10 items
  5. PCI-e lanes ≥ 5 5 items
Ttl Uarts
  1. TTL Uarts ≥1 14 items
  2. TTL Uarts ≥2 17 items
  3. TTL Uarts ≥3 12 items
USB
  1. USB 2.0 ≥ 1 18 items
  2. USB 2.0 ≥ 2 17 items
  3. USB 2.0 ≥ 3 14 items
  4. USB 2.0 ≥ 4 13 items
  5. USB 2.0 ≥ 5 8 items
  6. USB 2.0 ≥ 6 5 items
  7. USB 3.0 ≥ 1 12 items
  8. USB 3.0 ≥ 2 12 items
  9. USB 3.0 ≥ 3 2 items
  10. USB 3.1 ≥ 1 3 items
  11. USB 3.1 ≥ 2 2 items
  12. USB 3.2 ≥ 1 2 items
  13. USB 3.2 ≥ 2 3 items
  14. USB 4.0 ≥ 1 2 items
  15. USB 4.0 ≥ 2 2 items
  16. USB 4.0 ≥ 3 2 items
  17. USB 4.0 ≥ 4 4 items
  18. USB OTG 11 items
Video Interfaces
  1. DDI 1 item
  2. DP 5 items
  3. DP++ 13 items
  4. DUAL CHANNEL LVDS 15 items
  5. eDP 14 items
  6. HDMI 16 items
  7. MIPI-CSI camera conn 7 items
  8. MIPI-DSI 9 items
  9. PARALLEL RGB 2 items
  10. SINGLE CHANNEL LVDS 16 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 6 items
  2. M.2 SOCKET 2 KEY 3 items
  3. M.2 Socket 2 key B 4 items
  4. ONBOARD WI-FI/BLE 8 items
  5. /s/n/snapdragon-x_per_sito.jpg 1 item
Nuestros productos
  • Computer on Module
  • Single Board Computer (SBC)
  • Human Machine Interface
  • Fanless Embedded PCs
  • Industrial Embedded PCs
  • Payment Systems
  • Kits de desarrollo y accesorios
  • AI-Optimized Hardware
  • Evaluation Kit
  • Touch Display Solutions