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  1. Ethernet
    ETHERNET≥2
  2. Operating Temperature
    -20°C ÷ +60°C
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Cpu Maker
  1. AMD 3 items
  2. Arm System ready NXP 1 item
  3. Intel 7 items
  4. NXP 5 items
  5. Qualcomm 3 items
  6. Rockchip 1 item
Cpu Power Consumption
  1. range 10-25 W 7 items
  2. range < 10 W 9 items
  3. range > 25 W 2 items
Cpu Type
  1. AMD EPYC™ Embedded 3 1 item
  2. AMD Ryzen™ Embedded 1 item
  3. AMD® Ryzen™ embedded 1 item
  4. Intel® Atom™ 4 items
  5. Intel® Celeron® 4 items
  6. Intel® Core™ 3 items
  7. Intel® Pentium® 4 items
  8. NXP i.MX 8M Mini 1 item
  9. NXP i.MX 8X 2 items
  10. NXP i.MX 93 1 item
  11. NXP i.MX 95 1 item
  12. NXP i.MX8 1 item
  13. Qualcomm® QCS5430 1 item
  14. Qualcomm® QCS6490 1 item
  15. Rockchip RK3399 1 item
  16. Zynq® Ultras 1 item
  17. Qualcomm Dragonwing IQ-X 1 item
Ethernet
  1. ETHERNET≥1 37 items
  2. ETHERNET≥2 20 items
Form Factor
  1. COM Express® 2 items
  2. SMARC 7 items
  3. Boxed Solutions 4 items
  4. Single Board Computer 7 items
Form Factor Dimensions
  1. ≤ 100 x 100mm 8 items
  2. ≤ 80 x 80mm 4 items
  3. ≥ 100 x 100mm 7 items
  4. COM Express® 1 item
Form Factor Specification
  1. 3,5" 5 items
  2. COM Express Basic 1 item
  3. embedded NUC 1 item
  4. Pico-ITX 1 item
Memory
  1. memory ≤1 19 items
  2. memory ≤16 7 items
  3. memory ≤2 19 items
  4. memory ≤4 18 items
  5. memory ≤8 14 items
  6. memory ≥32 5 items
  7. soldered down 12 items
  8. SO_DIMM 5 items
  9. I2C EEPROM 1 item
  10. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 item
Mass Storage
  1. onboard SSD 2 items
  2. standard SATA connector 1 item
  3. I2C EEPROM 1 item
  4. M.2 NVMe SSD slot 1 item
  5. M.2 SATA SSD slot 5 items
  6. microSD card slot 5 items
  7. onboard eMMC 9 items
  8. onboard eMMC 4 items
  9. SATA channels ≥ 1 10 items
  10. SATA channels ≥ 2 5 items
  11. SATA channels ≥ 3 3 items
  12. SATA channels ≥ 4 3 items
  13. SD interface 3 items
  14. SD interface 3 items
  15. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 item
Operating Temperature
  1. -20°C ÷ +60°C 20 items
  2. -20°C ÷ +70°C 2 items
  3. -40°C ÷ +85°C 28 items
  4. 0°C ÷ +50°C 31 items
  5. 0°C ÷ +60°C 39 items
  6. 20°C ÷ +70°C 19 items
  7. -40°C ÷ +60°C 1 item
  8. -20°C ÷ +70°C 5 items
  9. -20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 14 items
  2. PCI-e lanes ≥ 2 12 items
  3. PCI-e lanes ≥ 3 6 items
  4. PCI-e lanes ≥ 4 5 items
  5. PCI-e lanes ≥ 5 2 items
Ttl Uarts
  1. TTL Uarts ≥1 12 items
  2. TTL Uarts ≥2 11 items
  3. TTL Uarts ≥3 7 items
USB
  1. USB 2.0 ≥ 1 15 items
  2. USB 2.0 ≥ 2 14 items
  3. USB 2.0 ≥ 3 13 items
  4. USB 2.0 ≥ 4 9 items
  5. USB 2.0 ≥ 5 5 items
  6. USB 2.0 ≥ 6 3 items
  7. USB 3.0 ≥ 1 9 items
  8. USB 3.0 ≥ 2 7 items
  9. USB 3.0 ≥ 3 2 items
  10. USB 3.1 ≥ 1 4 items
  11. USB 3.1 ≥ 2 2 items
  12. USB 3.2 ≥ 1 3 items
  13. USB 3.2 ≥ 2 3 items
  14. USB OTG 6 items
Video Interfaces
  1. DP 8 items
  2. DP++ 5 items
  3. DUAL CHANNEL LVDS 11 items
  4. eDP 11 items
  5. HDMI 8 items
  6. MIPI-CSI camera conn 3 items
  7. MIPI-DSI 4 items
  8. SINGLE CHANNEL LVDS 9 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 9 items
  2. M.2 SOCKET 2 KEY 2 items
  3. M.2 Socket 2 key B 2 items
  4. ONBOARD WI-FI/BLE 6 items
  5. /s/n/snapdragon-x_per_sito.jpg 1 item
Nuestros productos
  • Computer on Module
  • Single Board Computer (SBC)
  • Human Machine Interface
  • Fanless Embedded PCs
  • Industrial Embedded PCs
  • Payment Systems
  • Kits de desarrollo y accesorios
  • AI-Optimized Hardware
  • TFT Display
  • Modular Vision
  • Dev Kits, Carrier Boards and Accessories
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solution