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  1. Ethernet
    ETHERNET≥2
  2. Form Factor Dimensions
    ≥ 100 x 100mm
  3. USB
    USB 3.1 ≥ 1
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Cpu Maker
  1. AMD 1 item
  2. Qualcomm 1 item
Cpu Power Consumption
  1. range 10-25 W 2 items
  2. range < 10 W 1 item
  3. range < 5 W 1 item
  4. range > 25 W 2 items
Cpu Type
  1. AMD EPYC™ Embedded 3 1 item
  2. Qualcomm® QCS6490 1 item
Ethernet
  1. ETHERNET≥1 1 item
  2. ETHERNET≥2 2 items
Form Factor
  1. COM Express® 1 item
  2. SMARC 1 item
Form Factor Dimensions
  1. ≤ 100 x 100mm 3 items
  2. ≤ 80 x 80mm 2 items
  3. ≥ 100 x 100mm 2 items
Form Factor Specification
  1. COM Express Basic 1 item
Memory
  1. memory ≤1 1 item
  2. memory ≤16 1 item
  3. memory ≤2 1 item
  4. memory ≤4 1 item
  5. memory ≤8 1 item
  6. memory ≥32 1 item
  7. soldered down 1 item
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Mass Storage
  1. onboard eMMC 1 item
  2. SATA channels ≥ 1 1 item
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  4. SD interface 1 item
Operating Temperature
  1. -20°C ÷ +60°C 1 item
  2. -40°C ÷ +85°C 1 item
  3. 0°C ÷ +50°C 1 item
  4. 0°C ÷ +60°C 2 items
  5. 20°C ÷ +70°C 1 item
Pci Express
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  3. PCI-e lanes ≥ 3 1 item
  4. PCI-e lanes ≥ 4 1 item
  5. PCI-e lanes ≥ 5 1 item
Ttl Uarts
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  3. TTL Uarts ≥3 1 item
USB
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  2. USB 2.0 ≥ 2 9 items
  3. USB 2.0 ≥ 3 7 items
  4. USB 2.0 ≥ 4 5 items
  5. USB 2.0 ≥ 5 2 items
  6. USB 3.0 ≥ 1 8 items
  7. USB 3.0 ≥ 2 7 items
  8. USB 3.0 ≥ 3 3 items
  9. USB 3.0 ≥ 4 1 item
  10. USB 3.1 ≥ 1 2 items
  11. USB 3.1 ≥ 2 1 item
  12. USB OTG 4 items
Video Interfaces
  1. DP 1 item
  2. SINGLE CHANNEL LVDS 1 item
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 1 item
Nuestros productos
  • Computer on Module
  • Single Board Computer (SBC)
  • Human Machine Interface
  • Fanless Embedded PCs
  • Industrial Embedded PCs
  • Payment Systems
  • Kits de desarrollo y accesorios
  • AI-Optimized Hardware
  • Evaluation Kit
  • Touch Display Solutions