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    Qualcomm
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Cpu Maker
  1. AMD 12 items
  2. Arm System ready NXP 2 items
  3. Intel 50 items
  4. MediaTek 7 items
  5. NVIDIA 1 item
  6. NXP 39 items
  7. Qualcomm 13 items
  8. Rockchip 4 items
  9. Espressif 2 items
  10. Raspberry Pi 1 item
Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range < 10 W 1 item
  3. range < 5 W 2 items
  4. range > 25 W 1 item
Cpu Type
  1. NXP i.MX 93 1 item
  2. Qualcomm Snapdragon 1 item
  3. Qualcomm® QCS5430 1 item
  4. Qualcomm® QCS6490 4 items
  5. Qualcomm Dragonwing IQ-2390 1 item
  6. Qualcomm Dragonwing IQ-X 1 item
  7. Qualcomm Dragonwing IQ9 1 item
Ethernet
  1. ETHERNET≥1 8 items
  2. ETHERNET≥2 7 items
Form Factor
  1. COM Express® 2 items
  2. COM-HPC® 1 item
  3. Myon MicroModule SOM 1 item
  4. SMARC 4 items
  5. Boxed Solutions 1 item
  6. Modular HMIs 2 items
  7. Single Board Computer 2 items
Form Factor Dimensions
  1. 48,5 x 32,5 mm 1 item
  2. ≤ 100 x 100mm 3 items
  3. ≥ 100 x 100mm 2 items
  4. COM Express® 2 items
Form Factor Specification
  1. COM Express Compact 1 item
Memory
  1. memory ≤1 3 items
  2. memory ≤2 3 items
  3. memory ≤4 5 items
  4. memory ≤8 2 items
  5. soldered down 7 items
  6. memory ≤32 1 item
  7. UFS 3.1 module on-board 1 item
  8. I2C EEPROM 2 items
  9. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 item
Mounting Option
  1. VESA Mount 2 items
  2. Rear Mount 2 items
  3. Panel Mount 2 items
  4. Flush Mount 2 items
Mass Storage
  1. soldered down 1 item
  2. I2C EEPROM 1 item
  3. M.2 NVMe SSD slot 1 item
  4. microSD card slot 2 items
  5. onboard eMMC 2 items
  6. onboard eMMC 7 items
  7. SATA channels ≥ 2 1 item
  8. SD interface 1 item
  9. SD interface 5 items
  10. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 item
  11. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 2 items
Operating Temperature
  1. -20°C ÷ +60°C 3 items
  2. -40°C ÷ +85°C 4 items
  3. 0°C ÷ +50°C 3 items
  4. 0°C ÷ +60°C 11 items
  5. 20°C ÷ +70°C 2 items
  6. -20°C ÷ +70°C 2 items
  7. -40°C ÷ +60°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 2 items
  3. PCI-e lanes ≥ 4 1 item
  4. PCI-e lanes ≥ 5 2 items
Ttl Uarts
  1. TTL Uarts ≥1 4 items
  2. TTL Uarts ≥2 4 items
  3. TTL Uarts ≥3 2 items
USB
  1. USB 2.0 ≥ 1 5 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 3 items
  5. USB 2.0 ≥ 5 1 item
  6. USB 2.0 ≥ 6 1 item
  7. USB 3.0 ≥ 1 1 item
  8. USB 3.0 ≥ 2 1 item
  9. USB 3.0 ≥ 4 1 item
  10. USB 3.1 ≥ 1 4 items
  11. USB 3.2 ≥ 1 2 items
  12. USB CLIENT 2 items
  13. USB OTG 1 item
Video Interfaces
  1. DDI 1 item
  2. DP 6 items
  3. DUAL CHANNEL LVDS 4 items
  4. eDP 4 items
  5. HDMI 1 item
  6. MIPI-CSI camera conn 4 items
  7. MIPI-DSI 6 items
  8. SINGLE CHANNEL LVDS 3 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 items
  2. ONBOARD WI-FI/BLE 4 items
  3. /s/n/snapdragon-x_per_sito.jpg 1 item
Nuestros productos
  • Computer on Module
  • Single Board Computer (SBC)
  • Human Machine Interface
  • Fanless Embedded PCs
  • Industrial Embedded PCs
  • Payment Systems
  • Kits de desarrollo y accesorios
  • AI-Optimized Hardware
  • Evaluation Kit
  • Touch Display Solutions