SOM-SMARC-MX8M-Plus
Datos del producto
Descripción | Computer on Module (CoM) SMARC® Rel. 2.1.1 con procesadores NXP i.MX 8M Plus |
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Cpu | NXP i.MX 8M Plus family SoCs: Dual or Quad ARM Cortex®-A53 Cores + general purpose Cortex® M7 800MHz processor • NXP i.MX 8M Plus Quad, 4x ARM Cortex®-A53 Cores up to 1.8GHz • NXP i.MX 8M Plus Dual, 2x ARM Cortex®-A53 Cores up to 1.8GHz • NXP i.MX 8M Plus Quad Lite, 4x ARM Cortex®-A53 Cores up to 1.8GHz, no VPU / NPU
NPU: 2.3 TOPS Neural Network performance (not for Quad Lite) |
Núcleos máx. | 4+1 |
Memoria | Soldered down LPDDR4-4000 memory, 32-bit interface, up to 6GB |
Gráfica | Integrated Graphics Processing Unit GC7000UL, supports 3 independent displays. Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-4, MPEG-2, MVC, VC-1, RV, VP6, VP7, VP8, VP9, JPEG, HW encoding of HEVC/H.265, AVC/H.264 Supports OpenVG 1.1, OpenGL ES 3.1, OpenCL 1.2 Full Profile and Vulkan |
Interfaces vídeos | Up to 3 video display interfaces HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4/1.3 2xLVDS Single Channel / 1xLVDS Dual Channel or eDP + 1xLVDS Single Channel (factory alternatives) |
Resolución vídeo | HDMI: Up to 3840 x 2160 @30 |
Almacenamiento en masa | Soldered onboard eMMC 5.1 Drive, up to 64GB SD 4-bit interface |
Trabajo en red | Up to 2 x Gigabit Ethernet interfaces Optional WiFi + BT LE module onboard |
Usb | 2 x USB 2.0 Host Ports 2 x USB 3.0 Host Ports 1 x USB 2.0 Host/Client port |
Pci | Up to 1x PCI-e x1 Gen3 port |
Audio | Up to 2x I2S Audio interfaces |
Puertos de serie | 2x 2-wires UART 2x 4-wires UART |
Otras interfaces | 1x 4-lanes CSI camera interface 1x 2-lanes CSI camera interface 2x PWM Up to 14x GPIOs I2C bus SM bus SPI interface QuadSPI interface Watchdog Boot select signals Power Management Signals |
Alimentación eléctrica | +5VDC ± 5% and +3.3V_RTC |
Sistema operativo | Linux |
Temperatura de funcionamiento | 0°C ÷ +60°C ** (Commercial version) -40°C ÷ +85°C (Industrial version, without WiF+BT optional module)
**Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. |
Dimensiones | 50 x 82 mm (1.97” x 3.23”) |
RD18-3341-3111-I2 | Descripción número de pieza SOM-SMARC-MX8M-Plus with NXP i.MX8M Plus Quad, 4GB RAM, 32GB eMMC, HDMI, LVDS dual ch, 2x GbE, PCIe, Secure Element, Ind. temp. |
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