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SECO’s wide range of products for the most innovative projects: Modules, Single-Board Computers, Fanless Embedded Computers, HMIs and solutions for Smart Edge Computing, as well as Carrier Boards, Starter Kits, and all the accessories to complete your project.

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  1. SOM-COMe-CT6-ASL
    SOM-COMe-CT6-ASL
    COM Express® 3.1 Type 6 Compact Module with Intel Atom® Processors x7000E Series (Codename: Amston Lake and Alder Lake N)
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  2. SOM-COMe-BT6-MTL
    SOM-COMe-BT6-MTL
    COM Express® 3.1 Type 6 Basic Module with Intel® Core™ Ultra Processors Family (Codename: Meteor Lake -H and -U)
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  3. SOM-COM-HPC-A-MTL
    SOM-COM-HPC-A-MTL
    COM-HPC® Size A Client Module with Intel® Core™ Ultra Processors Family (codename: Meteor Lake -H and -U)
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  4. Palladio 400 RPL
    Palladio 400 RPL
    Modular fanless embedded PC with 13th Gen Intel® Core™ processors
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  5. Palladio 500 RPL
    Palladio 500 RPL
    Modular fanless embedded PC with 13th Gen Intel® Core™ processors
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  6. SBC-3.5-RV1000
    SBC-3.5-RV1000
    3.5” SBC with AMD Ryzen™ Embedded R1000 / V1000 family of SOCs. (MERIDA - C90)
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  7. SBC-S984-MX6
    SBC-S984-MX6
    SBC with NXP i.MX 6 Processor (VIKTORIA-S984)
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  8. Titan 235 APL
    Titan 235 APL
    Fanless Embedded Computer with Intel® Atom™ X Series (codename: Apollo Lake) Processors. (CYGNUS - SYS-B68-IPC)
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  9. Titan 230 APL
    Titan 230 APL
    Fanless Embedded Computer with Intel® Celeron® J / N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors. (HYDRUS - SYS-B68-IGW)
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  10. SBC-pITX-BT
    SBC-pITX-BT
    Pico-ITX SBC with Intel® Atom™ E3800 (codename: Bay Trail) Processors. (LAMPOS - A44)
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  1. Ethernet ETHERNET≥1 Remove This Item
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Cpu Power Consumption
  1. range 10-25 W 17 item
  2. range < 10 W 17 item
  3. range > 25 W 7 item
Cpu Type
  1. AMD EPYC™ Embedded 3000 Series   1 item
  2. AMD Ryzen™ Embedded R1000 2 item
  3. AMD® G-Series™ 1 item
  4. AMD® R-Series  1 item
  5. AMD® Ryzen™ embedded V-Series™ 3 item
  6. Intel® Atom™ 13 item
  7. Intel® Celeron® 12 item
  8. Intel® Core™  7 item
  9. Intel® Pentium®  8 item
  10. Intel® Xeon® 1 item
  11. NVIDIA Tegra® T30  1 item
  12. NXP i.MX6  2 item
  13. NXP i.MX8  1 item
  14. Zynq® Ultrascale+™  1 item
Form Factor
  1. Boxed Solutions 5 item
  2. COM Express® 10 item
  3. COM-HPC® 1 item
  4. Qseven 7 item
  5. Single Board Computer  7 item
  6. SMARC 3 item
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. 40x70 mm (µQseven, 1.57"x 2.76") 1 item
  3. ≤ 100 x 100mm 18 item
  4. ≤ 80 x 80mm 11 item
  5. ≥ 100 x 100mm 10 item
Form Factor Specification
  1. 3,5" 1 item
  2. COM Express Basic 4 item
  3. COM Express Compact 6 item
  4. COM-HPC Client 1 item
  5. embedded NUC 1 item
  6. Other Single Board Computers 3 item
  7. Pico-ITX 2 item
  8. Qseven 70x70 mm 6 item
  9. µQseven 70x40 1 item
Memory
  1. soldered down 15 item
  2. SO_DIMM 16 item
  3. ≤1 30 item
  4. ≤16 14 item
  5. ≤2 29 item
  6. ≤4 28 item
  7. ≤8 25 item
  8. ≥32 13 item
Pci Express
  1. PCI-e lanes ≥ 1 23 item
  2. PCI-e lanes ≥ 2 22 item
  3. PCI-e lanes ≥ 3 20 item
  4. PCI-e lanes ≥ 4 17 item
  5. PCI-e lanes ≥ 5 10 item
Ttl Uarts
  1. ≥1 21 item
  2. ≥2 16 item
  3. ≥3 2 item
USB
  1. USB 2.0 ≥ 1  28 item
  2. USB 2.0 ≥ 2  26 item
  3. USB 2.0 ≥ 3 24 item
  4. USB 2.0 ≥ 4 20 item
  5. USB 2.0 ≥ 5 16 item
  6. USB 2.0 ≥ 6 15 item
  7. USB 3.0 ≥ 1 19 item
  8. USB 3.0 ≥ 2 17 item
  9. USB 3.0 ≥ 3 9 item
  10. USB 3.0 ≥ 4 6 item
  11. USB 3.1 ≥ 1 4 item
  12. USB 3.1 ≥ 2 6 item
  13. USB 3.2 ≥ 1 4 item
  14. USB 3.2 ≥ 2 4 item
  15. USB CLIENT 1 item
  16. USB OTG 4 item
Video Interfaces
  1. DDI 8 item
  2. DP 19 item
  3. DP++ 10 item
  4. DUAL CHANNEL LVDS 18 item
  5. eDP 17 item
  6. HDMI 23 item
  7. MIPI-CSI camera connector 4 item
  8. MIPI-DSI 1 item
  9. SINGLE CHANNEL LVDS 20 item
  10. VGA 2 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY AND WLAN SLOT (WI-FI/BT typ.) 8 item
  2. M.2 SOCKET 2 KEY AND WLAN SLOT (MODEMS typ.) 3 item
  3. M.2 Socket 2 key B (SSD) 5 item
  4. ONBOARD WI-FI/BLE 1 item