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SECO’s wide range of products for the most innovative projects: Modules, Single-Board Computers, Fanless Embedded Computers, HMIs and solutions for Smart Edge Computing, as well as Carrier Boards, Starter Kits, and all the accessories to complete your project.

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  1. SOM-SMARC-ASL
    SOM-SMARC-ASL
    SMARC® Rel 2.1 compliant module with Intel Atom® Processors x7000RE Series for the Edge
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  2. SOM-COMe-CT6-ASL
    SOM-COMe-CT6-ASL
    COM Express® 3.1 Type 6 Compact Module with Intel Atom® Processors x7000E Series (Codename: Amston Lake and Alder Lake N)
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  3. SOM-COMe-BT6-MTL
    SOM-COMe-BT6-MTL
    COM Express® 3.1 Type 6 Basic Module with Intel® Core™ Ultra Processors Family (Codename: Meteor Lake -H and -U)
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  4. SOM-COM-HPC-A-MTL
    SOM-COM-HPC-A-MTL
    COM-HPC® Size A Client Module with Intel® Core™ Ultra Processors Family (codename: Meteor Lake -H and -U)
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  5. Palladio 400 RPL
    Palladio 400 RPL
    Modular fanless embedded PC with 13th Gen Intel® Core™ processors
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  6. Palladio 500 RPL
    Palladio 500 RPL
    Modular fanless embedded PC with 13th Gen Intel® Core™ processors
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  7. SBC-3.5-RV1000
    SBC-3.5-RV1000
    3.5” SBC with AMD Ryzen™ Embedded R1000 / V1000 family of SOCs. (MERIDA - C90)
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  8. SBC-S984-MX6
    SBC-S984-MX6
    SBC with NXP i.MX 6 Processor (VIKTORIA-S984)
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  9. Titan 235 APL
    Titan 235 APL
    Fanless Embedded Computer with Intel® Atom™ X Series (codename: Apollo Lake) Processors. (CYGNUS - SYS-B68-IPC)
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  10. Titan 230 APL
    Titan 230 APL
    Fanless Embedded Computer with Intel® Celeron® J / N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors. (HYDRUS - SYS-B68-IGW)
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Cpu Power Consumption
  1. range 10-25 W 19 item
  2. range < 10 W 18 item
  3. range > 25 W 7 item
Cpu Type
  1. AMD EPYC™ Embedded 3000 Series   1 item
  2. AMD Ryzen™ Embedded R1000 2 item
  3. AMD® G-Series™ 1 item
  4. AMD® R-Series  1 item
  5. AMD® Ryzen™ embedded V-Series™ 3 item
  6. Intel® Atom™ 15 item
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  10. Intel® Xeon® 1 item
  11. NVIDIA Tegra® T30  1 item
  12. NXP i.MX6  2 item
  13. NXP i.MX8  1 item
  14. Zynq® Ultrascale+™  1 item
Form Factor
  1. Boxed Solutions 5 item
  2. COM Express® 12 item
  3. COM-HPC® 1 item
  4. Qseven 7 item
  5. Single Board Computer  7 item
  6. SMARC 4 item
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. 40x70 mm (µQseven, 1.57"x 2.76") 1 item
  3. ≤ 100 x 100mm 21 item
  4. ≤ 80 x 80mm 11 item
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Form Factor Specification
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  2. COM Express Basic 4 item
  3. COM Express Compact 8 item
  4. COM-HPC Client 1 item
  5. embedded NUC 1 item
  6. Other Single Board Computers 3 item
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  8. Qseven 70x70 mm 6 item
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Memory
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  3. ≤1 32 item
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  6. ≤4 31 item
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  2. -20°C ÷ +70°C 5 item
  3. -40°C ÷ +85°C 23 item
  4. 0°C ÷ +50°C 30 item
  5. 0°C ÷ +60°C 33 item
  6. 20°C ÷ +70°C 22 item
Pci Express
  1. PCI-e lanes ≥ 1 27 item
  2. PCI-e lanes ≥ 2 26 item
  3. PCI-e lanes ≥ 3 24 item
  4. PCI-e lanes ≥ 4 21 item
  5. PCI-e lanes ≥ 5 12 item
Ttl Uarts
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  2. ≥2 18 item
  3. ≥3 2 item
USB
  1. USB 2.0 ≥ 1  32 item
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  3. USB 2.0 ≥ 3 28 item
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  10. USB 3.0 ≥ 4 7 item
  11. USB 3.1 ≥ 1 5 item
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  15. USB 4.0 ≥ 1 1 item
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  19. USB CLIENT 1 item
  20. USB OTG 4 item
Video Interfaces
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  2. DP 22 item
  3. DP++ 13 item
  4. DUAL CHANNEL LVDS 21 item
  5. eDP 20 item
  6. HDMI 26 item
  7. MIPI-CSI camera connector 6 item
  8. MIPI-DSI 2 item
  9. SINGLE CHANNEL LVDS 22 item
  10. VGA 3 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY AND WLAN SLOT (WI-FI/BT typ.) 8 item
  2. M.2 SOCKET 2 KEY AND WLAN SLOT (MODEMS typ.) 3 item
  3. M.2 Socket 2 key B (SSD) 5 item
  4. ONBOARD WI-FI/BLE 1 item