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SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm® IQ8 Applications Processors

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Modular Link IQ-615

DIN Mount Industrial Gateway with the Qualcomm® IQ-615 SoC

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SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors

SOM-SMARC-QCS6490

SOM-SMARC-QCS6490

SMARC® 2.1.1 module powered by Qualcomm® Dragonwing™ QCS6490 processor. (E81)

SOM-SMARC-QCS5430

SOM-SMARC-QCS5430

SMARC® 2.1.1 module powered by Qualcomm® Dragonwing™ QCS5430 processor. (E81)

Qualcomm Processor

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Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range < 10 W 1 item
  3. range < 5 W 2 items
  4. range > 25 W 1 item
Cpu Type
  1. Qualcomm Snapdragon 1 item
  2. Qualcomm® QCS6490 1 item
Ethernet
  1. ETHERNET≥1 1 item
  2. ETHERNET≥2 1 item
Form Factor
  1. Myon MicroModule SOM 1 item
  2. SMARC 1 item
Form Factor Dimensions
  1. 48,5 x 32,5 mm 1 item
  2. ≥ 100 x 100mm 1 item
Memory
  1. memory ≤1 1 item
  2. memory ≤2 1 item
  3. soldered down 1 item
Mass Storage
  1. I2C EEPROM 1 item
  2. onboard eMMC 2 items
  3. onboard eMMC 5 items
  4. SD interface 1 item
  5. SD interface 5 items
  6. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 item
  7. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. 0°C ÷ +60°C 1 item
Ttl Uarts
  1. TTL Uarts ≥3 1 item
USB
  1. USB 2.0 ≥ 1 1 item
  2. USB 3.1 ≥ 1 1 item
  3. USB OTG 1 item
Video Interfaces
  1. DP 1 item
  2. MIPI-DSI 1 item
  3. SINGLE CHANNEL LVDS 1 item
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 1 item