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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)

UDOO x86 II

UDOO x86 II

SBC based on Intel® Celeron® and Pentium® Applications Processor

UDOO VISION

UDOO VISION

Pico-ITX Single Board Computer with the Intel® Atom® X Series, Intel® Celeron® N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPS

Intel Processor

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    -20°C ÷ +70°C
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Cpu Type
  1. Intel® Atom™ 1 item
  2. Intel® Celeron® 1 item
  3. Intel® Core™ 3 items
  4. Intel® Pentium® 1 item
Ethernet
  1. ETHERNET≥1 4 items
  2. ETHERNET≥2 2 items
Form Factor
  1. COM Express® 2 items
  2. Boxed Solutions 2 items
Form Factor Dimensions
  1. ≤ 100 x 100mm 2 items
Form Factor Specification
  1. COM Express Compact 2 items
Memory
  1. memory ≤1 4 items
  2. memory ≤16 4 items
  3. memory ≤2 4 items
  4. memory ≤4 4 items
  5. memory ≤8 4 items
  6. memory ≥32 4 items
  7. SO_DIMM 3 items
Mass Storage
  1. M.2 SATA SSD slot 2 items
  2. onboard eMMC 1 item
  3. SATA channels ≥ 1 4 items
  4. SATA channels ≥ 2 4 items
  5. SATA channels ≥ 3 2 items
  6. SATA channels ≥ 4 2 items
Operating Temperature
  1. -20°C ÷ +60°C 17 items
  2. -20°C ÷ +70°C 4 items
  3. -40°C ÷ +85°C 23 items
  4. 0°C ÷ +50°C 27 items
  5. 0°C ÷ +60°C 40 items
  6. 20°C ÷ +70°C 16 items
  7. -20°C ÷ +70°C 4 items
Pci Express
  1. PCI-e lanes ≥ 1 3 items
  2. PCI-e lanes ≥ 2 3 items
  3. PCI-e lanes ≥ 3 2 items
  4. PCI-e lanes ≥ 4 2 items
  5. PCI-e lanes ≥ 5 2 items
Ttl Uarts
  1. TTL Uarts ≥1 2 items
  2. TTL Uarts ≥2 2 items
USB
  1. USB 2.0 ≥ 1 2 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 2 items
  5. USB 2.0 ≥ 5 2 items
  6. USB 2.0 ≥ 6 2 items
  7. USB 3.2 ≥ 1 3 items
  8. USB 3.2 ≥ 2 3 items
Video Interfaces
  1. DDI 1 item
  2. DP 2 items
  3. DUAL CHANNEL LVDS 1 item
  4. eDP 1 item
  5. SINGLE CHANNEL LVDS 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 items