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SOM-COMe-BT6-PTLCOM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)x86 COM Express® Intel Processor AI-Optimized Hardware -
Titan 300 TGL-UP3 AIFanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPSx86 Intel Processor Fanless Embedded PCs AI-Optimized Hardware -
Titan 300 TGL-UP3Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)Intel Processor Fanless Embedded PCs -
SOM-SMARC-TWLSMARC® Rel. 2.1 compliant module with Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Twin Lake). (E08)Computer on Module SMARC® Intel Processor -
SOM-COMe-CT6-TGL-UCOM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with 11th Gen Intel® Core™ (Codename: Tiger Lake UP3) Processors. (CALYPSO - D40)x86 COM Express® Intel Processor -
SOM-COMe-CT6-EHLCOM Express® 3.1 Type 6 Compact Computer on Module (CoM) with Intel Atom® x6000E Series, Intel® Pentium® and Celeron® N and J Series Processors (Codename: Elkhart Lake). (E37)x86 COM Express® Intel Processor




