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Titan 300 TGL-UP3 AIFanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPSx86 Intel Processor Fanless Embedded PCs AI-Optimized Hardware -
Titan 300 TGL-UP3Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)Intel Processor Fanless Embedded PCs -
SOM-SMARC-TWLSMARC® Rel. 2.1 compliant module with Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Twin Lake). (E08)Computer on Module SMARC® Intel Processor -
SOM-COM-HPC-A-MTLCOM-HPC® Size A Client Module with Intel® Core™ Ultra Processors Family (codename: Meteor Lake -H and -U). (E87)x86 Computer on Module COM-HPC® Intel Processor -
SOM-COM-HPC-A-RPLCOM-HPC® Client module Size A, with 13th Gen Intel® Core™ processors (Codename: Raptor Lake – H/P/U series). (ORION - D80)x86 Computer on Module COM-HPC® Intel Processor AI-Optimized Hardware -
SBC-3.5-TGL-UP33.5” SBC with 11th Gen Intel® Core™ and Intel® Celeron® (codename: Tiger Lake-UP3). (PRISMA - D64)Intel Processor Single Board Computer 3.5-inch SBC




