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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

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Modular Link IQ-615

DIN Mount Industrial Gateway with the Qualcomm® IQ-615 SoC

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPS

Titan 300 TGL-UP3

Titan 300 TGL-UP3

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)

Titan 290 EHL

Titan 290 EHL

Fanless embedded computer with the Intel Atom® X6000E Series, Intel® Pentium® and Celeron® N and J Series (codename: Elkhart Lake) SoCs. (PYXIS - SYS-D63-IPC)

Fanless Embedded PCs

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Cpu Maker
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Cpu Power Consumption
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Cpu Type
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  2. Intel® Celeron® 1 item
  3. Intel® Pentium® 1 item
  4. NXP i.MX 93 2 items
Ethernet
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  2. ETHERNET≥2 5 items
Form Factor
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Form Factor Dimensions
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Memory
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  2. memory ≤2 3 items
  3. memory ≤4 2 items
  4. memory ≤8 2 items
  5. soldered down 2 items
Mass Storage
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  2. M.2 NVMe SSD slot 1 item
  3. M.2 SATA SSD slot 7 items
  4. microSD card slot 2 items
  5. onboard eMMC 5 items
  6. onboard eMMC 5 items
  7. SATA channels ≥ 1 4 items
  8. SATA channels ≥ 2 2 items
  9. SATA channels ≥ 3 2 items
  10. SATA channels ≥ 4 2 items
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  2. 0°C ÷ +50°C 3 items
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  4. 20°C ÷ +70°C 1 item
  5. -40°C ÷ +60°C 1 item
  6. -20°C ÷ +70°C 1 item
USB
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  5. USB 3.1 ≥ 1 1 item
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Video Interfaces
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  2. DP++ 3 items
  3. HDMI 3 items
Wireless Connectivity
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  2. M.2 Socket 2 key B 2 items
  3. ONBOARD WI-FI/BLE 3 items