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SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H). (F36)

UDOO x86 II

UDOO x86 II

SBC based on Intel® Celeron® and Pentium® Applications Processor

UDOO VISION

UDOO VISION

Pico-ITX Single Board Computer with the Intel® Atom® X Series, Intel® Celeron® N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors

UDOO BOLT GEAR

UDOO BOLT GEAR

Boxed solution based on AMD Embedded Ryzen V1605B Applications Processor

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPS

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  1. Form Factor Dimensions
    120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout)
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Ethernet
  1. ETHERNET≥1 2 items
  2. ETHERNET≥2 1 item
Form Factor
  1. COM Express® 2 items
  2. COM-HPC® 1 item
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 3 items
  2. ≤ 100 x 100mm 18 items
  3. ≤ 80 x 80mm 4 items
  4. ≥ 100 x 100mm 10 items
  5. COM Express® 2 items
Form Factor Specification
  1. COM Express Basic 2 items
  2. COM-HPC Client 1 item
Memory
  1. memory ≥32 2 items
  2. SO_DIMM 1 item
Mass Storage
  1. M.2 SATA SSD slot 3 items
  2. SATA channels ≥ 2 1 item
  3. SATA channels ≥ 2 1 item
USB
  1. USB 4.0 ≥ 2 2 items
  2. USB OTG 3 items
Video Interfaces
  1. DDI 3 items
  2. DUAL CHANNEL LVDS 2 items
  3. eDP 3 items
  4. HDMI 3 items
  5. MIPI-CSI camera conn 2 items