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SOM-SMARC-Dragonwing-IQ8

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

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SOM-Trizeps-X-Genio360

SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor. (F67)

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Modular Vision 10.1 MX95

Entry level 10.1 inch HMI based on NXP i.MX95

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SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)

Titan 225 RK3399

Titan 225 RK3399

Fanless Embedded Computer based on Rockchip RK3399 Applications Processor. (PICTOR - SYS-C31-IPC)

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    Qualcomm® Dragonwing IQ-8
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Cpu Type
  1. AMD® Ryzen™ embedded 1 item
  2. MediaTek Genio 510 1 item
  3. MediaTek Genio 700 1 item
  4. NXP i.MX 8M 5 items
  5. NXP i.MX 8M Mini 6 items
  6. NXP i.MX 8M Nano 3 items
  7. NXP i.MX 8M Plus 2 items
  8. NXP i.MX 8X 2 items
  9. NXP i.MX 93 1 item
  10. NXP i.MX 933/935 1 item
  11. NXP i.MX 95 2 items
  12. NXP i.MX6 10 items
  13. NXP i.MX8 3 items
  14. Qualcomm® QCS5430 1 item
  15. Qualcomm® QCS6490 1 item
  16. Rockchip RK3399 2 items
  17. Rockchip RK3568 1 item
  18. Zynq® Ultras 1 item
  19. Qualcomm Dragonwing IQ-X 1 item
  20. MediaTek Genio360 1 item
  21. Qualcomm® Dragonwing IQ-8 1 item
Memory
  1. soldered down 1 item
  2. memory ≤32 1 item
Mass Storage
  1. SD interface 1 item
  2. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -40°C ÷ +85°C 1 item
  2. 0°C ÷ +60°C 1 item
USB
  1. USB 2.0 ≥ 5 1 item
  2. USB 3.0 ≥ 2 1 item
Video Interfaces
  1. DP 1 item
  2. DUAL CHANNEL LVDS 1 item
  3. MIPI-CSI camera conn 1 item
  4. MIPI-DSI 1 item
  5. SINGLE CHANNEL LVDS 1 item