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Available samples

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  1. Easy Edge (sample)
    Easy Edge (sample)
    IoT Sensor to Cloud
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  2. ELECTRA (sample)
    ELECTRA (sample)
    μQseven® module with NXP i.MX 8M Mini & NXP i.MX 8M Nano Processors
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  3. LEXELL (sample)
    LEXELL (sample)
    SMARC® Rel. 2.1.1 module with NXP i.MX 8M Applications Processors
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  4. HALLEY (sample)
    HALLEY (sample)
    SMARC® Rel. 2.1.1 module with Intel® Atom® x6000E Series and Intel® Pentium® and Celeron® N and J Series (formerly Elkhart Lake) Processors for FuSa applications
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  5. MAIA (sample)
    MAIA (sample)
    Qseven® Rel. 2.1 module with NXP i.MX 8 Applications Processors
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  6. MERIDA (sample)
    MERIDA (sample)
    3.5” SBC with AMD Ryzen™ Embedded R1000 / V1000 family of SOCs
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  7. ASTRID (sample)
    ASTRID (sample)
    3.5” SBC with the NXP i.MX 8M Mini Processors
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  8. OBERON (sample)
    OBERON (sample)
    COM Express® Rel. 3.0 Basic Type 6 module with Intel® 8th generation Core™/ Xeon® (formerly Coffee Lake) and 9th generation Core™ / Xeon® / Celeron® (formerly Coffee Lake Refresh) Processors
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  9. NAOS (sample)
    NAOS (sample)
    Qseven® Rel. 2.1 module with Intel® Atom X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors
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  10. Easy Edge DEV KIT (sample)
    Easy Edge DEV KIT (sample)
    Easy Edge System WiFi/LTE Development kit
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Cpu Power Consumption
  1. range 10-25 W 4 item
  2. range < 10 W 7 item
  3. range > 25 W 2 item
Cpu Type
  1. AMD Ryzen™ Embedded R1000 1 item
  2. AMD® Ryzen™ embedded V-Series™ 1 item
  3. Espressif ESP32-D0WD 1 item
  4. Intel® Atom™ 2 item
  5. Intel® Celeron® 3 item
  6. Intel® Core™  1 item
  7. Intel® Pentium®  2 item
  8. Intel® Xeon® 1 item
  9. NXP i.MX 8M Mini 2 item
  10. NXP i.MX 8M Nano 1 item
  11. NXP i.MX8  2 item
Ethernet
  1. ETHERNET≥1 8 item
  2. ETHERNET≥2 3 item
Form Factor
  1. Boxed Solutions 1 item
  2. COM Express® 1 item
  3. ESP32 1 item
  4. Qseven 3 item
  5. Single Board Computer  2 item
  6. SMARC 2 item
Form Factor Dimensions
  1. 40x70 mm (µQseven, 1.57"x 2.76") 1 item
  2. ≤ 100 x 100mm 1 item
  3. ≤ 80 x 80mm 3 item
  4. ≥ 100 x 100mm 4 item
Form Factor Specification
  1. 3,5" 2 item
  2. COM Express Basic 1 item
  3. ESP32 1 item
  4. Qseven 70x70 mm 2 item
  5. µQseven 70x40 1 item
Mass Storage
  1. M.2 NVMe SSD slot 1 item
  2. microSD card slot  3 item
  3. onboard eMMC 4 item
  4. onboard SSD 2 item
  5. SATA channels ≥ 1 5 item
  6. SATA channels ≥ 2  3 item
  7. SATA channels ≥ 3 1 item
  8. SATA channels ≥ 4 1 item
  9. SD interface  5 item
Memory
  1. soldered down 7 item
  2. SO_DIMM 2 item
  3. ≤1 8 item
  4. ≤16 3 item
  5. ≤2 8 item
  6. ≤4 8 item
  7. ≤8 4 item
  8. ≥32 2 item
Operating Temperature
  1. -20°C ÷ +60°C 2 item
  2. -20°C ÷ +70°C 1 item
  3. -40°C ÷ +85°C 6 item
  4. 0°C ÷ +50°C 2 item
  5. 0°C ÷ +60°C 7 item
  6. 20°C ÷ +70°C 2 item
Pci Express
  1. PCI-e lanes ≥ 1 7 item
  2. PCI-e lanes ≥ 2 6 item
  3. PCI-e lanes ≥ 3 4 item
  4. PCI-e lanes ≥ 4 4 item
  5. PCI-e lanes ≥ 5 2 item
Ttl Uarts
  1. ≥1 8 item
  2. ≥2 5 item
  3. ≥3 2 item
USB
  1. USB 2.0 ≥ 1  8 item
  2. USB 2.0 ≥ 2  8 item
  3. USB 2.0 ≥ 3 7 item
  4. USB 2.0 ≥ 4 6 item
  5. USB 2.0 ≥ 5 4 item
  6. USB 2.0 ≥ 6 3 item
  7. USB 3.0 ≥ 1 6 item
  8. USB 3.0 ≥ 2 5 item
  9. USB 3.0 ≥ 3 2 item
  10. USB 3.0 ≥ 4 1 item
  11. USB OTG 3 item
Video Interfaces
  1. DDI 1 item
  2. DP 2 item
  3. DP++ 3 item
  4. DUAL CHANNEL LVDS 7 item
  5. eDP 6 item
  6. HDMI 5 item
  7. MIPI-CSI camera connector 2 item
  8. MIPI-DSI 1 item
  9. SINGLE CHANNEL LVDS 6 item
  10. VGA 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY AND WLAN SLOT (WI-FI/BT typ.) 1 item
  2. M.2 SOCKET 2 KEY AND WLAN SLOT (MODEMS typ.) 1 item
  3. ONBOARD WI-FI/BLE 4 item