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COM Express Standard
For high-end design and markets
High graphic processing capabilities
Rich functionality
For high-performance projects
2 formats: Basic (4.92 x 3.74 in) and Compact (3. 74 x 3.74 in)
Advantages of the Computer-on-Module Approach
Design investment limited to the carrier board
Consolidated standards
Scalable and future-proof solutions
Long-term availability
ARM and x86 compatibility
Multi-vendor solutions
Highly configurable
Innovative and updatable solutions
Reduced time-to-market
Description
The COM Express® standard lets you customize your projects quickly and cost-effectively. SECO modules are available in COM Express® Type 6 and Type 7, in two formats: “Basic”, with dimensions of 4.92 x 3.74 in, suited to highly energy-sensitive devices, and “Compact”, 3.74 x 3.74 in, a good compromise between high performance and reduced size.
COM Express® Interfaces
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SOM-COMe-BT6-RPL-PCOM Express® 3.1 Type 6 Basic Computer on Module (CoM) with 13th Gen Intel® Core™ processors (Codename: Raptor Lake-P). (CALLISTO - E03)
Category
- 3.5" Standard 8
- COM Express Standard 13
- COM-HPC Standard 4
- Embedded NUC Standard 1
- Pico-ITX Standard 4
- Qseven Standard 8
- SMARC Standard 13
- μQseven Standard 4
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Category
- 3.5" Standard 8
- COM Express Standard 13
- COM-HPC Standard 4
- Embedded NUC Standard 1
- Pico-ITX Standard 4
- Qseven Standard 8
- SMARC Standard 13
- μQseven Standard 4
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Cpu Power Consumption
Cpu Type
Ethernet
Form Factor Dimensions
Form Factor Specification
Mass Storage
Memory
Operating Temperature
Pci Express
USB
- USB 2.0 ≥ 1 9 item
- USB 2.0 ≥ 2 9 item
- USB 2.0 ≥ 3 9 item
- USB 2.0 ≥ 4 9 item
- USB 2.0 ≥ 5 9 item
- USB 2.0 ≥ 6 10 item
- USB 3.0 ≥ 1 7 item
- USB 3.0 ≥ 2 7 item
- USB 3.0 ≥ 3 7 item
- USB 3.0 ≥ 4 7 item
- USB 3.1 ≥ 1 2 item
- USB 3.1 ≥ 2 2 item
- USB 3.2 ≥ 1 1 item
- USB 3.2 ≥ 2 2 item
- USB 4.0 ≥ 2 1 item
- USB CLIENT 1 item
- USB OTG 1 item