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COM Express Standard

COM Express Standard

For high-end design and markets
High graphic processing capabilities
Rich functionality
For high-performance projects
2 formats: Basic (4.92 x 3.74 in) and Compact (3. 74 x 3.74 in)
Advantages of the Computer-on-Module Approach
Design investment limited to the carrier board
Consolidated standards
Scalable and future-proof solutions
Long-term availability
ARM and x86 compatibility
Multi-vendor solutions
Highly configurable
Innovative and updatable solutions
Reduced time-to-market
Description

The COM Express® standard lets you customize your projects quickly and cost-effectively. SECO modules are available in COM Express® Type 6 and Type 7, in two formats: “Basic”, with dimensions of 4.92 x 3.74 in, suited to highly energy-sensitive devices, and “Compact”, 3.74 x 3.74 in, a good compromise between high performance and reduced size.

COM Express® Interfaces

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  1. SOM-COMe-BT6-RPL-P
    SOM-COMe-BT6-RPL-P
    COM Express® 3.1 Type 6 Basic Computer on Module (CoM) with 13th Gen Intel® Core™ processors (Codename: Raptor Lake-P). (CALLISTO - E03)
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  1. Form Factor COM Express® Remove This Item
  2. Pci Express PCI-e lanes ≥ 5 Remove This Item
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Cpu Power Consumption
  1. range 10-25 W 7 item
  2. range < 10 W 1 item
  3. range > 25 W 6 item
Cpu Type
  1. AMD EPYC™ Embedded 3000 Series   1 item
  2. AMD Ryzen™ Embedded R1000 1 item
  3. AMD® Ryzen™ embedded V-Series™ 2 item
  4. Intel® Atom™ 1 item
  5. Intel® Celeron® 3 item
  6. Intel® Core™  6 item
  7. Intel® Pentium®  2 item
  8. Intel® Xeon® 1 item
Ethernet
  1. ETHERNET≥1 10 item
  2. ETHERNET≥2 1 item
Form Factor Dimensions
  1. ≤ 100 x 100mm 6 item
  2. ≥ 100 x 100mm 3 item
Form Factor Specification
  1. COM Express Basic 5 item
  2. COM Express Compact 6 item
Mass Storage
  1. CFAST slot 1 item
  2. M.2 NVMe SSD slot 2 item
  3. microSD card slot  1 item
  4. onboard eMMC 2 item
  5. SATA channels ≥ 1 9 item
  6. SATA channels ≥ 2  11 item
  7. SATA channels ≥ 3 3 item
  8. SATA channels ≥ 4 1 item
  9. SD interface  1 item
Memory
  1. soldered down 1 item
  2. SO_DIMM 10 item
  3. ≤1 8 item
  4. ≤16 9 item
  5. ≤2 8 item
  6. ≤4 9 item
  7. ≤8 9 item
  8. ≥32 11 item
Operating Temperature
  1. -20°C ÷ +60°C 5 item
  2. -20°C ÷ +70°C 2 item
  3. -40°C ÷ +85°C 7 item
  4. 0°C ÷ +50°C 8 item
  5. 0°C ÷ +60°C 10 item
  6. 20°C ÷ +70°C 4 item
Ttl Uarts
  1. ≥1 8 item
  2. ≥2 9 item
USB
  1. USB 2.0 ≥ 1  8 item
  2. USB 2.0 ≥ 2  8 item
  3. USB 2.0 ≥ 3 8 item
  4. USB 2.0 ≥ 4 8 item
  5. USB 2.0 ≥ 5 8 item
  6. USB 2.0 ≥ 6 9 item
  7. USB 3.0 ≥ 1 5 item
  8. USB 3.0 ≥ 2 5 item
  9. USB 3.0 ≥ 3 5 item
  10. USB 3.0 ≥ 4 5 item
  11. USB 3.1 ≥ 1 3 item
  12. USB 3.1 ≥ 2 3 item
  13. USB 3.2 ≥ 1 1 item
  14. USB 3.2 ≥ 2 2 item
  15. USB 4.0 ≥ 2 1 item
  16. USB CLIENT 1 item
  17. USB OTG 1 item
Video Interfaces
  1. DDI 8 item
  2. DP 7 item
  3. DP++ 1 item
  4. DUAL CHANNEL LVDS 9 item
  5. eDP 9 item
  6. HDMI 8 item
  7. MIPI-CSI camera connector 1 item
  8. PARALLEL RGB 1 item
  9. SINGLE CHANNEL LVDS 9 item
  10. VGA 4 item