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HMI Solutions
Touch displays
Experience in assembly services
Experience in mechanical design
Possibilities Offered by SECO
Touch integration for Resistive, Capacitive and Projected Capacitive technologies
Touch-screen customization
LCD Air Bonding, OCA, and OCR touch-screen bonding technologies
Heat dissipation solutions – both passive and active via a fan – also for the newest CPUs, with the aid of heat pipe systems where necessary.
Manufacturing of plastic elements with injection molding
Production of aluminum mechanical parts with extrusion technology
Design of mechanical parts with die-casting technology
Bending and pressing of sheet metal parts
Development of personalized wiring to manage the connection of all parts of systems containing one or more boards/displays
Description
Thanks to its experience in integrating modules and boards into complex systems, SECO has created user-ready, off-the-shelf HMI solutions with touch displays and integrated boards, based on its own ARM and x86 SBCs that are also available in our catalog. Get inspired and find ideas for your own custom solution.
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Modular Vision 10.1 MX8M-PlusHigh end 10.1 inch HMI based on NXP i.MX8M Plus -
Flexy Vision 10.1 APLPanel PC with 10.1” LCD display based on the Intel® Atom™ X Series and Intel® Celeron J / N Series (codename: Apollo Lake) Processors -
Flexy Vision 13.3 APLPanel PC with 13.3” LCD display based on the Intel® Atom™ X Series and Intel® Celeron® J / N Series (codename: Apollo Lake) Processors -
Flexy Vision 13.3 RK3399Panel PC with 13.3” LCD display based on Rockchip RK3399 SoC -
Flexy Vision 15.6 APLPanel PC with 15.6” LCD display based on the Intel® Atom™ X Series and Intel® Celeron® J / N Series (codename: Apollo Lake) Processors -
Flexy Vision 15.6 RK3399Panel PC with 15.6” LCD display based on Rockchip RK3399 SoC -
Flexy Vision 21.5 APLPanel PC with 2Flexy Vision 21.5 APL1.5” LCD display based on the Intel® Atom™ X Series and Intel® Celeron® J / N Series (codename: Apollo Lake) Processors
