SOM-SMARC-MX93




製品詳細
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SMARC® Rel. 2.1.1 Computer on Module (CoM) with NXP i.MX 9 Applications Processors |
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1-2x Arm® Cortex®-A55 @ 1.7 GHz |
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Soldered-down LPDDR4X/LPDDR4-3200 memory, up to 2GB total, 16-bit interface |
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LVDS Single Channel |
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LVDS Single Channel |
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MIPI-DSI: up to 1080p60 |
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eMMC 5.1 Drive soldered on-board, up to 64GB (boot device) |
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2x Gigabit Ethernet interfaces, opt. Wi-Fi + BT5.0 |
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1x USB 2.0 OTG port |
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1x I2S port |
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2x UART (4-wires) |
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12 x GPIOs |
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TPM |
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Power management |
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+5VDC ± 5% and +3.3V_RTC |
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Linux |
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0 to +60°C (Commercial Range) *Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
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82 x 50 mm |
EE39-1FH1-1431-E2 | 品番内容 SOM-SMARC-MX93 w/NXP i.MX93 Sub-Family 52, 2GB RAM, 32GB eMMC, DSI1, LVDS, Wifi AW-CM276NF, 2x Ethernet, USB-Hub, TPM, Extended Temperature | |
EE39-1FH2-1431-E2 | 品番内容 SOM-SMARC-MX93 w/NXP i.MX93 Sub-Family 52, 2GB RAM, 32GB eMMC, eDP, LVDS, Wifi AW-CM276NF, 2x Ethernet, USB-Hub, TPM, Extended Temperature | |
EE39-1FF1-0411-E2 | 品番内容 SOM-SMARC-MX93 w/NXP i.MX93 Sub-Family 52, 2GB RAM, 16GB eMMC, DSI, LVDS, 2x Ethernet, TPM, Extended Temperature | |
EE39-1KD1-0210-E2 | 品番内容 SOM-SMARC-MX93 w/NXP i.MX93 Sub-Family 52, 1GB RAM, 8GB eMMC, DSI, LVDS, 1x Ethernet, Extended Temperature | |
RE39-1FF1-0411-E2 | 品番内容 NXP i.MX93 Sub-Family 52, 2GB RAM, 16GB eMMC, DSI, LVDS, 2x Ethernet, TPM, Extended Temperature - Mass-Product | |
RE39-1KD1-0210-E2 | 品番内容 NXP i.MX93 Sub-Family 52, 1GB RAM, 8GB eMMC, DSI, LVDS, 1x Ethernet, Extended Temperature - Low-Cost | |
RE39-1FH2-1431-E2 | 品番内容 NXP i.MX93 Sub-Family 52, 2GB RAM, 32GB eMMC, eDP, LVDS, Wifi AW-CM276NF, 2x Ethernet, USB-Hub, TPM, Extended Temperature - Eval-Type |
