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SOM-COMe-CT6-P100

COM Express® 3.1 Type 6 Compact Module with AMD Ryzen™ AI Embedded P100 Series

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors

SOM-COMe-CT6-WHL-U

SOM-COMe-CT6-WHL-U

第8世代インテル® Core™プロセッサ、Celeron™ U-シリーズ(旧称Whiskey Lake-U) プロセッサを搭載したCOM Express® Rel.3.0 Compact Type 6 モジュール (Codename: Whiskey Lake-U) Processors. (LARISSA - C55)

SOM-COMe-CT6-V2000

SOM-COMe-CT6-V2000

インテル® Xeon® D-1700 プロセッサ（旧称Ice Lake- D）搭載COM Express® Rel.3.0 Basic Type 7 モジュール . (OPHELIA - D21)

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  1. Operating Temperature
    -40°C ÷ +85°C
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Cpu Maker
  1. AMD 4 items
  2. Intel 8 items
  3. Qualcomm 1 item
  4. Rockchip 1 item
Cpu Power Consumption
  1. range 10-25 W 6 items
  2. range < 10 W 2 items
  3. range > 25 W 6 items
Cpu Type
  1. AMD EPYC™ Embedded 3 1 item
  2. AMD Ryzen™ Embedded 2 items
  3. AMD® Ryzen™ embedded 1 item
  4. Intel® Atom™ 4 items
  5. Intel® Celeron® 2 items
  6. Intel® Core™ 6 items
  7. Intel® Pentium® 3 items
  8. Rockchip RK3588 1 item
  9. Qualcomm Dragonwing IQ-X 1 item
Ethernet
  1. ETHERNET≥1 12 items
  2. ETHERNET≥2 2 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. ≤ 100 x 100mm 8 items
  3. ≥ 100 x 100mm 3 items
  4. COM Express® 2 items
Form Factor Specification
  1. COM Express Basic 4 items
  2. COM Express Compact 9 items
Memory
  1. memory ≤1 10 items
  2. memory ≤16 9 items
  3. memory ≤2 9 items
  4. memory ≤4 10 items
  5. memory ≤8 10 items
  6. memory ≥32 9 items
  7. soldered down 1 item
  8. SO_DIMM 11 items
  9. I2C EEPROM 1 item
  10. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 item
Mass Storage
  1. CFAST slot 1 item
  2. I2C EEPROM 1 item
  3. M.2 NVMe SSD slot 1 item
  4. microSD card slot 2 items
  5. onboard eMMC 6 items
  6. SATA channels ≥ 1 12 items
  7. SATA channels ≥ 2 10 items
  8. SATA channels ≥ 2 2 items
  9. SATA channels ≥ 3 1 item
  10. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 item
Operating Temperature
  1. -20°C ÷ +60°C 11 items
  2. -20°C ÷ +70°C 2 items
  3. -40°C ÷ +85°C 14 items
  4. 0°C ÷ +50°C 13 items
  5. 0°C ÷ +60°C 20 items
  6. 20°C ÷ +70°C 8 items
  7. -20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 11 items
  2. PCI-e lanes ≥ 2 11 items
  3. PCI-e lanes ≥ 3 11 items
  4. PCI-e lanes ≥ 4 12 items
  5. PCI-e lanes ≥ 5 11 items
Ttl Uarts
  1. TTL Uarts ≥1 11 items
  2. TTL Uarts ≥2 12 items
USB
  1. USB 2.0 ≥ 1 10 items
  2. USB 2.0 ≥ 2 9 items
  3. USB 2.0 ≥ 3 9 items
  4. USB 2.0 ≥ 4 9 items
  5. USB 2.0 ≥ 5 9 items
  6. USB 2.0 ≥ 6 10 items
  7. USB 3.0 ≥ 1 7 items
  8. USB 3.0 ≥ 2 7 items
  9. USB 3.0 ≥ 3 7 items
  10. USB 3.0 ≥ 4 3 items
  11. USB 3.1 ≥ 1 5 items
  12. USB 3.1 ≥ 2 5 items
  13. USB 3.2 ≥ 1 1 item
  14. USB 3.2 ≥ 2 2 items
  15. USB 4.0 ≥ 2 1 item
  16. USB CLIENT 2 items
  17. USB OTG 1 item
Video Interfaces
  1. DDI 9 items
  2. DP 9 items
  3. DP++ 1 item
  4. DUAL CHANNEL LVDS 9 items
  5. eDP 11 items
  6. HDMI 10 items
  7. PARALLEL RGB 1 item
  8. SINGLE CHANNEL LVDS 10 items
  9. VGA 3 items
Wireless Connectivity
  1. /s/n/snapdragon-x_per_sito.jpg 1 item