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SOM-COMe-CT6-P100

COM Express® 3.1 Type 6 Compact Module with AMD Ryzen™ AI Embedded P100 Series

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)

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SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors

SOM-COMe-CT6-WHL-U

SOM-COMe-CT6-WHL-U

第8世代インテル® Core™プロセッサ、Celeron™ U-シリーズ(旧称Whiskey Lake-U) プロセッサを搭載したCOM Express® Rel.3.0 Compact Type 6 モジュール (Codename: Whiskey Lake-U) Processors. (LARISSA - C55)

SOM-COMe-CT6-V2000

SOM-COMe-CT6-V2000

インテル® Xeon® D-1700 プロセッサ（旧称Ice Lake- D）搭載COM Express® Rel.3.0 Basic Type 7 モジュール . (OPHELIA - D21)

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Cpu Maker
  1. AMD 1 item
  2. Qualcomm 1 item
Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range > 25 W 1 item
Cpu Type
  1. AMD EPYC™ Embedded 3 1 item
  2. Qualcomm Dragonwing IQ-X 1 item
Ethernet
  1. ETHERNET≥1 19 items
  2. ETHERNET≥2 2 items
Form Factor Dimensions
  1. ≥ 100 x 100mm 1 item
  2. COM Express® 1 item
Form Factor Specification
  1. COM Express Basic 1 item
Memory
  1. memory ≤1 1 item
  2. memory ≤16 1 item
  3. memory ≤2 1 item
  4. memory ≤4 1 item
  5. memory ≤8 1 item
  6. memory ≥32 1 item
  7. SO_DIMM 1 item
  8. I2C EEPROM 1 item
  9. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 item
Mass Storage
  1. I2C EEPROM 1 item
  2. SATA channels ≥ 1 1 item
  3. SATA channels ≥ 2 1 item
  4. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 item
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. -40°C ÷ +85°C 2 items
  3. 0°C ÷ +50°C 2 items
  4. 0°C ÷ +60°C 2 items
  5. 20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 1 item
  2. PCI-e lanes ≥ 2 1 item
  3. PCI-e lanes ≥ 3 1 item
  4. PCI-e lanes ≥ 4 1 item
  5. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. TTL Uarts ≥1 1 item
  2. TTL Uarts ≥2 1 item
USB
  1. USB 3.1 ≥ 1 1 item
  2. USB 3.1 ≥ 2 1 item
Wireless Connectivity
  1. /s/n/snapdragon-x_per_sito.jpg 1 item