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SOM-SMARC-Dragonwing-IQ8

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.2 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

/images/trizeps/som-trizeps-x-genio-front-main.jpg

SOM-Trizeps-X-Genio360

SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor. (F67)

/images/hmi/modular-vision-front-main-10-1.jpg

Modular Vision 10.1 MX95

Entry level 10.1 inch HMI based on NXP i.MX95

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)

Titan 225 RK3399

Titan 225 RK3399

Rockchip RK3399アプリケーションプロセッサ搭載、ファンレス組込みコンピュータ. (PICTOR - SYS-C31-IPC)

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  1. MediaTek 1 item
  2. NXP 4 items
Cpu Type
  1. NXP i.MX 8M Mini 1 item
  2. NXP i.MX 8M Nano 1 item
  3. NXP i.MX6 3 items
  4. MediaTek Genio360 1 item
Ethernet
  1. ETHERNET≥1 4 items
  2. ETHERNET≥2 2 items
Form Factor
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  2. Single Board Computer 4 items
Form Factor Dimensions
  1. 67,6 x 36,7 mm 1 item
Form Factor Specification
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Memory
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  2. memory ≤2 3 items
  3. memory ≤4 2 items
  4. memory ≤8 1 item
Mass Storage
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  2. microSD card slot 7 items
  3. onboard eMMC 1 item
  4. onboard eMMC 13 items
  5. onboard eMMC 5 items
  6. SATA channels ≥ 1 2 items
  7. SATA channels ≥ 2 1 item
  8. SD interface 6 items
  9. SD interface 3 items
Operating Temperature
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Ttl Uarts
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  5. USB OTG 3 items
Video Interfaces
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  2. DUAL CHANNEL LVDS 6 items
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  7. PARALLEL RGB 1 item
  8. SINGLE CHANNEL LVDS 5 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
  2. M.2 SOCKET 2 KEY 2 items