Menu
Account
AI最適化ハードウェア

最新製品

/images/fanless-pc/palladio-500-rpl-ai-main.jpg

Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

第11世代Intel® Core™およびIntel® Celeron® SoCs（コードネーム：Tiger Lake UP3）とAxelera AIチップを搭載したファンレスの組み込みコンピュータ：単一のMetis AIPUによって最大120 TOPSで駆動されます

SOM-SMARC-QCS6490

SOM-SMARC-QCS6490

SMARC® 2.1.1 module powered by Qualcomm® Dragonwing™ QCS6490 processor

SOM-SMARC-QCS5430

SOM-SMARC-QCS5430

SMARC® 2.1.1 module powered by Qualcomm® Dragonwing™ QCS5430 processor

AI最適化ハードウェア

Shop By
Clear All

3 Items

Set Descending Direction
per page
Shop By
今購入中：
  1. Form Factor
    Boxed Solutions
Clear All
Shopping Options
Cpu Type
  1. Intel® Celeron® 1 item
  2. Intel® Core™ 3 items
Ethernet
  1. ETHERNET≥1 3 items
  2. ETHERNET≥2 3 items
Form Factor
  1. COM Express® 2 items
  2. COM-HPC® 2 items
  3. SMARC 7 items
  4. Boxed Solutions 3 items
Memory
  1. memory ≤1 3 items
  2. memory ≤16 3 items
  3. memory ≤2 3 items
  4. memory ≤4 3 items
  5. memory ≤8 3 items
  6. memory ≥32 3 items
  7. SO_DIMM 3 items
Mass Storage
  1. M.2 SATA SSD slot 2 items
  2. SATA channels ≥ 1 2 items
  3. SATA channels ≥ 2 2 items
  4. SATA channels ≥ 3 2 items
  5. SATA channels ≥ 4 2 items
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. -20°C ÷ +70°C 1 item
  3. 0°C ÷ +50°C 2 items
  4. 0°C ÷ +60°C 2 items
  5. 20°C ÷ +70°C 2 items
  6. -20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 2 items
USB
  1. USB 3.2 ≥ 1 3 items
  2. USB 3.2 ≥ 2 3 items
Video Interfaces
  1. DP 2 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 3 items
  2. M.2 SOCKET 2 KEY 1 item