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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H). (F36)

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

第11世代Intel® Core™およびIntel® Celeron® SoCs（コードネーム：Tiger Lake UP3）とAxelera AIチップを搭載したファンレスの組み込みコンピュータ：単一のMetis AIPUによって最大120 TOPSで駆動されます

SOM-SMARC-QCS6490

SOM-SMARC-QCS6490

SMARC® 2.1.1 module powered by Qualcomm Dragonwing™ QCS6490 processor. (E81)

SOM-SMARC-QCS5430

SOM-SMARC-QCS5430

SMARC® 2.1.1 module powered by Qualcomm Dragonwing™ QCS5430 processor. (E81)

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