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SOM-COMe-CT6-TGL-U

SOM-COMe-CT6-TGL-U

第11世代インテル® Core™ (旧称Tiger Lake UP3)プロセッサを搭載したCOM Express® Rel.3.0 Compact Type 6 モジュール (Codename: Tiger Lake UP3) Processors. (CALYPSO - D40)

工業用温度範囲で使用可能

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CPU

Intel® Core™ Series (formerly Tiger Lake UP3) Processors

グラフィック

Integrated Intel® Iris® Xe Graphics, up to 96 Execution Units

接続性

1x GbE; 4x SuperSpeed USB 5Gbps; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x4 Gen4

メモリ

Two DDR4 SO-DIMM Slots supporting DDR4-3200 IBECC memory, up to 64GB

製品詳細

技術情報

商品説明	COM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with 11th Gen Intel® Core™ (formerly Tiger Lake UP3) Processors
Cpu	Intel® Core™ i7-1185G7E, Quad Core @2.8GHz (4.4GHz Turbo Boost), 12MB Cache, 28W TDP (12W cTDP), with Hyperthreading Intel® Core™ i5-1145G7E, Quad Core @2.6GHz (4.1GHz Turbo Boost), 8MB Cache, 28W TDP (12W cTDP), with Hyperthreading Intel® Core™ i3-1115G4E, Dual Core @3.0GHz (3.9GHz Turbo Boost), 6MB Cache, 28W TDP (12W cTDP), with Hyperthreading Intel® Core™ i7-1185GRE, Quad Core @2.8GHz (4.4GHz Turbo Boost), 12MB Cache, with IBECC, 28W TDP (12W cTDP), with Hyperthreading - Industrial Intel® Core™ i5-1145GRE, Quad Core @2.6GHz (4.1GHz Turbo Boost), 8MB Cache, with IBECC, 28W TDP (12W cTDP), with Hyperthreading - Industrial Intel® Core™ i3-1115GRE, Dual Core @3.0GHz (3.9GHz Turbo Boost), 6MB Cache, with IBECC, 28W TDP (12W cTDP), with Hyperthreading - Industrial
メモリ	Two DDR4 SO-DIMM slots supporting DDR4-3200 memory, up to 64GB IBECC DDR4 memory modules supported only with Intel® Core™ Industrial SoCs
グラフィック	Intel® Iris® Xe Graphics, up to 96 Execution Units Up to 4 independent displays supported Support DirectX 12, OpenGL 4.6, OpenCL 3.0 and Vulkan 1.2 HW accelerated video decode AVC/H.264, HEVC/H.265, VP81, VP9, AV1 HW accelerated video encode AVC/H.264, HEVC/H.265, VP81, VP9
ビデオインターフェース	Up to 3x Digital Display Interfaces (DDIs), supporting DP 1.2, eDP 1.4, HDMI 1.4, DVI 1 x eDP 1.4 or Single/Dual-Channel 18-/24-bit LVDS interface 1 x VGA interface
動画解像度	eDP, DP: up to 5120x3200 @60Hz 24bpp / 7680x4320 @60Hz 30bpp with DSC HDMI: up to 4096x2160 @24Hz, 24bpp LVDS: up to 1920x1200 @60Hz VGA: up to 2048 x 1536 @50Hz
大容量記憶装置	2x SATA Gen3 channels 2x PCI-e x4 ports available for M.2 NVMe drives
ネットワーク	Gigabit Ethernet interface Intel® I225 GbE controller
USB	4x SuperSpeed USB 5Gbps host ports 8x USB 2.0 Host ports
PCI	8x PCI-e x1 Gen3 lanes PCI-express Graphics (PEG) x4 Gen4
オーディオ	HD audio interface
シリアルポート	2x UARTs
その他のインターフェース	SPI, I2C, SM bus, thermal management, FAN management LPC bus Optional TPM 2.0 on-board LID#/SLEEP#/PWRBTN#, Watchdog 4x GPI, 4x GPO
電源装置	8VDC..20VDC, +5VSB (optional), +3VRTC (optional)
OS	Microsoft® Windows 10 Microsoft® Windows 10 IoT Core Linux
動作温度	0°C ÷ +60°C (Commercial) -40°C ÷ +85°C (Industrial) Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider applicationspecific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
寸法	95 x 95 mm (COM Express® Compact Form factor, Type 6 pinout)

ソフトウェア

リンク	SECO Technical Resources

文書化

Data Sheet	[Datasheet] SOM-COMe-CT6-TGL-U Rel 1.1
Image	[Picture] SOM-COMe-CT6-TGL-U_front [Picture] SOM-COMe-CT6-TGL-U_back
Manual	[Manual] SOM-COMe-CT6-TGL-U Rel 1.0

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