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SOM-COMe-CT6-MBPF
製品詳細
商品説明
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SOM-COMe-CT6-MBPF is a COM Express® Compact Type 6 Computer on Module (CoM) with the AMD Embedded 3rd generation R-Series SoC (formerly Merlin Falcon), G-Series SoC-I (formerly Brown Falcon) or G-Series SoC-J (formerly Prairie Falcon) designed by SECO that features up to 4 Excavator x86 CPU cores with the latest Radeon graphics and I / O Controller on a single Chip; each Processor can scale the TDP down to 15W. SOM-COMe-CT6-MBPF is ideal in applications where scalable graphics performance makes the difference. |
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Cpu
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AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), TDP 35W AMD GX-224IJ, Dual Core @ 2.4GHz (2.8GHz Max), cTDP 10-15W |
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最大コア数
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4 |
|
メモリ
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R-Series: Two SO-DIMM slots supporting DDR4 ECC / nonECC modules up to 2133MHz G-Series SoC-I: Two SO-DIMM slots supporting DDR4 ECC / non-ECC modules up to 1600MHz G-Series SoC-J: One SO-DIMM slot supporting DDR4 nonECC modules up to 2133MHz |
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グラフィック
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AMD Radeon 3rd -Generation Graphics Core Next (GCN) |
ビデオインターフェース
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Up to 3 x Digital Display Interfaces (DDIs), supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0 (up to 2x DDIs with G-Series SoC-I and SoC-J) |
動画解像度
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DDIs: up to 4K |
大容量記憶装置
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2 x SATA Gen3 Channels |
ネットワーク
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Gigabit Ethernet interface |
USB
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4 x USB 3.0 Host ports |
|
PCI
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3 x PCI-e x 1 lanes |
オーディオ
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HD Audio Interface |
シリアルポート
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2 x HS UARTs |
その他のインターフェース
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SPI, I2C Bus, SM Bus, LPC Bus, 2 x Express Card, FAN management |
電源装置
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+12VDC ± 10% and + 5VSB (optional) |
OS
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Microsoft® Windows 7 |
動作温度
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0°C ÷ +60 °C (Commercial version) *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
寸法
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95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout) |
