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SOM-SMARC-Dragonwing-IQ8

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

/images/trizeps/som-trizeps-x-genio-front-main.jpg

SOM-Trizeps-X-Genio360

SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor. (F67)

/images/hmi/modular-vision-front-main-10-1.jpg

Modular Vision 10.1 MX95

Entry level 10.1 inch HMI based on NXP i.MX95

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)

Titan 225 RK3399

Titan 225 RK3399

Ordinateur embarqué sans ventilateur basé sur le processeur Rockchip RK3399. (PICTOR - SYS-C31-IPC)

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  1. Form Factor Dimensions
    48,5 x 32,5 mm
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Shopping Options
Cpu Type
  1. NXP i.MX 8M Mini 1 item
  2. NXP i.MX 8M Nano 1 item
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. 40x70 mm (µQseven, 1.57"x 2.76") 1 item
  3. 48,5 x 32,5 mm 1 item
  4. 67,6 x 36,7 mm 5 items
  5. ≤ 100 x 100mm 15 items
  6. ≤ 80 x 80mm 9 items
  7. ≥ 100 x 100mm 11 items
  8. COM Express® 1 item
Memory
  1. memory ≤1 1 item
  2. memory ≤2 1 item
  3. memory ≤4 1 item
  4. memory ≤8 1 item
Ttl Uarts
  1. TTL Uarts ≥1 1 item
  2. TTL Uarts ≥2 1 item
  3. TTL Uarts ≥3 1 item
USB
  1. USB 2.0 ≥ 1 1 item
  2. USB 2.0 ≥ 2 1 item
  3. USB OTG 1 item
Video Interfaces
  1. DUAL CHANNEL LVDS 1 item
  2. MIPI-DSI 1 item
  3. SINGLE CHANNEL LVDS 1 item