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SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H). (F36)

UDOO x86 II

UDOO x86 II

SBC basé sur le processeur Intel® Celeron® et Pentium®

UDOO VISION

UDOO VISION

Ordinateur monocarte Pico-ITX avec processeurs Intel® Atom® série X, Intel® Celeron® série N, Intel® Pentium® série N (codename: Apollo Lake)

UDOO BOLT GEAR

UDOO BOLT GEAR

Solution en boîtier basée sur le processeur embarqué AMD Ryzen V1605B

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Ordinateur embarqué sans ventilateur avec les processeurs Intel® Core™ de 11ème génération et les SoCs Intel® Celeron® (Codename: Tiger Lake UP3) ainsi que la puce d'IA Axelera : alimenté par un seul Metis AIPU jusqu'à 120 TOPS

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  1. Cpu Type
    Intel® Celeron®
  2. Ethernet
    ETHERNET≥1
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Shopping Options
Cpu Power Consumption
  1. range 10-25 W 9 items
  2. range < 10 W 9 items
  3. range > 25 W 2 items
Cpu Type
  1. AMD EPYC™ Embedded 3 1 item
  2. AMD Ryzen™ Embedded 1 item
  3. AMD® G-Series™ 1 item
  4. AMD® R-Series 1 item
  5. AMD® Ryzen™ embedded 1 item
  6. Espressif ESP32-D0WD 1 item
  7. Intel® Atom™ 15 items
  8. Intel® Celeron® 16 items
  9. Intel® Core™ 15 items
  10. Intel® Pentium® 12 items
  11. Intel® Xeon® 2 items
Ethernet
  1. ETHERNET≥1 16 items
  2. ETHERNET≥2 9 items
Form Factor
  1. COM Express® 4 items
  2. COM-HPC® 1 item
  3. Qseven 2 items
  4. Single Board Compute 1 item
  5. SMARC 2 items
  6. Boxed Solutions 2 items
  7. Single Board Computer 1 item
  8. Single Board Computer 3 items
Form Factor Dimensions
  1. ≤ 100 x 100mm 8 items
  2. ≤ 80 x 80mm 4 items
  3. ≥ 100 x 100mm 4 items
Form Factor Specification
  1. COM Express Basic 1 item
  2. COM Express Compact 3 items
  3. COM-HPC Client 1 item
  4. embedded NUC 1 item
  5. Other SBCs 2 items
  6. Pico-ITX 2 items
  7. Qseven 70x70 mm 2 items
Memory
  1. memory ≤1 12 items
  2. memory ≤16 7 items
  3. memory ≤2 13 items
  4. memory ≤4 13 items
  5. memory ≤8 15 items
  6. memory ≥32 4 items
  7. soldered down 10 items
  8. SO_DIMM 5 items
Mass Storage
  1. onboard SSD 2 items
  2. standard SATA connector 4 items
  3. M.2 SATA SSD slot 5 items
  4. microSD card slot 5 items
  5. onboard eMMC 2 items
  6. onboard eMMC 10 items
  7. SATA channels ≥ 1 10 items
  8. SATA channels ≥ 2 6 items
  9. SATA channels ≥ 3 2 items
  10. SATA channels ≥ 4 1 item
  11. SD interface 4 items
Operating Temperature
  1. -20°C ÷ +60°C 6 items
  2. -20°C ÷ +70°C 1 item
  3. -40°C ÷ +85°C 10 items
  4. 0°C ÷ +50°C 9 items
  5. 0°C ÷ +60°C 14 items
  6. 20°C ÷ +70°C 7 items
Pci Express
  1. PCI-e lanes ≥ 1 9 items
  2. PCI-e lanes ≥ 2 9 items
  3. PCI-e lanes ≥ 3 9 items
  4. PCI-e lanes ≥ 4 9 items
  5. PCI-e lanes ≥ 5 3 items
Ttl Uarts
  1. TTL Uarts ≥1 6 items
  2. TTL Uarts ≥2 9 items
  3. TTL Uarts ≥3 1 item
USB
  1. USB 2.0 ≥ 1 11 items
  2. USB 2.0 ≥ 2 11 items
  3. USB 2.0 ≥ 3 9 items
  4. USB 2.0 ≥ 4 9 items
  5. USB 2.0 ≥ 5 9 items
  6. USB 2.0 ≥ 6 9 items
  7. USB 3.0 ≥ 1 6 items
  8. USB 3.0 ≥ 2 6 items
  9. USB 3.0 ≥ 3 5 items
  10. USB 3.0 ≥ 4 2 items
  11. USB 3.1 ≥ 1 2 items
  12. USB 3.1 ≥ 2 2 items
  13. USB 3.2 ≥ 1 3 items
  14. USB 3.2 ≥ 2 5 items
  15. USB 4.0 ≥ 1 1 item
  16. USB 4.0 ≥ 2 1 item
Video Interfaces
  1. DDI 4 items
  2. DP 4 items
  3. DP++ 11 items
  4. DUAL CHANNEL LVDS 8 items
  5. eDP 11 items
  6. HDMI 11 items
  7. MIPI-CSI camera conn 1 item
  8. MIPI-DSI 1 item
  9. SINGLE CHANNEL LVDS 8 items
  10. VGA 3 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 5 items
  2. M.2 SOCKET 2 KEY 3 items
  3. M.2 Socket 2 key B 3 items