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SOM-COM-HPC-A-TGL-H

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SOM-COM-HPC-A-TGL-H

Module client COM-HPC® Taille A avec processeurs Intel® Xeon® série W-11000E, Core™ vPro® et Celeron® (Codename: Tiger Lake-H) de 11e génération pour applications FuSa. (LAGOON - D57)

Available in Industrial Temperature Range

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Cpu

11th Gen Intel® Xeon®, Core™ and Celeron® processors

Graphiques

Intel® Iris Xe Graphics Core Gen12 GPU with up to 32 EU, up to 4 independent displays

Connectivité

2x USB 4; 2x USB 3.2 Gen 2x2; 8x USB 2.0; 20x PCI-e Gen3 lanes; 20x PCI-e Gen4 lanes; up to 2x 2.5GbE

Mémoire

Two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory

Détails produit

Info technique

Description	Module client COM-HPC® Taille A avec processeurs Intel® Xeon® série W-11000E, Core™ vPro® et Celeron® (anciennement Tiger Lake-H) de 11e génération pour applications FuSa
Cpu	11th Generation Intel® Xeon®, Core™ and Celeron® Processors, also available in industrial temperature range. • Intel® Core™ vPRO® i7-11850HE, Eight Core @ 2.6GHz (up to 4.7GHz in Turbo Boost) with HT, 24MB Cache L3, 45/35W cTDP • Intel® Core™ vPRO® i5-11500HE, Six Core @ 2.6GHz (up to 4.5GHz in Turbo Boost) with HT, 12MB L3 Cache, 45/35W cTDP • Intel® Core™ i3-11100HE, Quad Core @ 2.4GHz (up to 4.4GHz in Turbo Boost) with HT, 8MB L3 Cache, 45/35W cTDP • Intel® Celeron® 6600HE, Dual Core @2.6GHz, 8MB L3 Cache, 35W TDP • Intel® Xeon® vPRO® W-11865MRE, Eight Core @ 2.6GHz (up to 4.7GHz in Turbo Boost) with HT, 24MB L3 Cache, with ECC, TCC/TSN and Functional Safety Essential Design package, 45/35W cTDP – Industrial (w/ Turbo OFF) • Intel® Xeon® vPRO® W-11555MRE, Six Core @ 2.6GHz (up to 4.5GHz in Turbo Boost) with HT, 12MB L3 Cache, with ECC, TCC/TSN and Functional Safety Essential Design package, 45/35W cTDP – Industrial (w/ Turbo OFF) • Intel® Xeon® W-11155MRE, Quad Core @ 2.4GHz (up to 4.4GHz in Turbo Boost) with HT, 8MB L3 Cache, with ECC and TCC/TSN, 45/35W cTDP – Industrial (w/ Turbo OFF) • Intel® Xeon® vPRO® W-11865MLE, Eight Core @ 1.5GHz (up to 4.5GHz in Turbo Boost) with HT, 24MB L3 Cache, with ECC and TCC/TSN, 25W TDP • Intel® Xeon® vPRO® W-11555MLE, Six Core @ 1.9GHz (up to 4.4GHz in Turbo Boost) with HT, 24MB L3 Cache, with ECC and TCC/TSN, 25W TDP • Intel® Xeon® W-11155MLE, Quad Core @ 1.8GHz (up to 3.1GHz in Turbo Boost) with HT, 24MB L3 Cache, with ECC and TCC/TSN, 25W TDP B Cache, 28/15/12W cTDP - Industrial (w/ Turbo OFF)
Cores max	8
Mémoire	2x DDR4-3200 SODIMM Slots with ECC (In-Band Error Correction Code), up to 64GB supported
Graphiques	Integrated Iris Xe Graphics Core Gen12 architecture, with up to 32 Execution Units and up to 2 VDbox MPEG2, WMV9, AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP9, AV1 HW decoding, up to 8k60. AVC/H.264, HEVC/H.265, JPEG, VP9 HW encoding, up to 8k30 Support up to 4 independent displays.
Interfaces vidéo	1x eDP 1.4b or MIPI_DSI 1.3 Up to 3x DP++ interface, supporting Display Port 1.4a and HDMI 2.0b Up to 2x Display Port over Type-C (Alternate mode)
Résolution vidéo	DP, eDP: Up to 5120x3200 @60Hz 24bpp / 7680x4320@60Hz 30bpp with DSC MIPI-DSI: Up to 3200x2000 @60Hz 24bpp, 5120x3200 @60Hz 24bpp with DSC HDMI 1.4: Up to 4Kx2K 24-30Hz 24bpp HDMI 2.0b: Up to 4Kx2K 48-60Hz 24bpp / 4Kx2K 48- 60Hz 12bpc (need dedicated redriver on carrier board)
Stockage masse	2 x S-ATA Gen3 Channels PCI-e x4 port can be used to connect, on the carrier board, M.2 NVMe drives
Réseau	Up to 2x NBase-T Ethernet interfaces, supporting 2.5Gb Ethernet connection, managed by as many Intel® i225 2.5GbE Controllers with TSN
Usb	2x USB4 ports 2x USB 3.2 Gen 2x2 ports 8 x USB 2.0 Host ports
Pci	1x PCI-e x4 Gen 4 port for NVME 16x PCI-e Gen4 lanes, can be used to support 1x PCI-e x16, 2x PCI-e x8 or (1x PCI-e x8 +2x PCI-e x4) root ports 20x PCI-e Gen 3 lanes, groupable to support up to 12 root ports, max allowed grouping PCI-e x4
Audio	SoundWire and I2S Audio Interface
Ports sériels	2x legacy UARTs, managed by the Embedded Controller
Autres Interfaces	2x 4-lane CSI-2 interfaces, optional SPI, eSPI, SM Bus, 2x I2C, Watchdog timer, Carrier board FAN Control Management signals, ACPI signals, Safety Status signals Deep Sleep / Battery support Optional TPM 2.0 module on-board 12x GPIOs
Alimentation	+8VDC .. +20VDC Main power supply +5V stand-by
Système d’exploitation	Windows 10 IoT Enterprise LTSC Linux Kernel LTS Yocto Project 3.0 WindRiver VxWorks 7.0 Android
Température de fonctionnement	0°C ÷ +60°C (Commercial version) -40°C ÷ +85°C (Industrial Range)
Dimensions	120 x 95 mm (COM-HPC® Size A Form factor, Client pinout)

Logiciel

Lien	SECO Technical Resources

Documentation

Data Sheet	[Datasheet] SOM-COM-HPC-A-TGL-H Rel. 1.0
Image	[Picture] LAGOON_front [Picture] LAGOON_back

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