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COM Express®
COM-HPC®
Qseven®
SMARC®
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Trizeps SODIMM (SOM)
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    ONBOARD WI-FI/BLE
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Cpu Maker
  1. Intel 1 item
  2. MediaTek 1 item
  3. NXP 6 items
Cpu Power Consumption
  1. range < 10 W 3 items
Cpu Type
  1. Intel® Core™ 1 item
  2. MediaTek Genio 700 1 item
  3. NXP i.MX 8M 2 items
  4. NXP i.MX 8M Mini 1 item
  5. NXP i.MX 8M Nano 1 item
  6. NXP i.MX 8M Plus 1 item
  7. NXP i.MX 8X 1 item
  8. NXP i.MX 933/935 1 item
Ethernet
  1. ETHERNET≥1 5 items
  2. ETHERNET≥2 4 items
Form Factor
  1. COM-HPC® 1 item
  2. Qseven 2 items
  3. SMARC 5 items
Form Factor Dimensions
  1. 40x70 mm (µQseven, 1.57"x 2.76") 1 item
  2. ≤ 100 x 100mm 6 items
  3. ≤ 80 x 80mm 6 items
Form Factor Specification
  1. COM-HPC Client 1 item
  2. Qseven 70x70 mm 1 item
  3. µQseven 70x40 1 item
Memory
  1. memory ≤1 6 items
  2. memory ≤2 7 items
  3. memory ≤4 6 items
  4. memory ≤8 1 item
  5. memory ≥32 1 item
  6. soldered down 7 items
  7. SO_DIMM 1 item
Mass Storage
  1. M.2 NVMe SSD slot 1 item
  2. microSD card slot 1 item
  3. onboard eMMC 6 items
  4. onboard eMMC 1 item
  5. SATA channels ≥ 2 1 item
  6. SD interface 5 items
Operating Temperature
  1. -20°C ÷ +60°C 5 items
  2. -40°C ÷ +85°C 7 items
  3. 0°C ÷ +50°C 5 items
  4. 0°C ÷ +60°C 7 items
  5. 20°C ÷ +70°C 4 items
  6. -20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 5 items
  2. PCI-e lanes ≥ 2 1 item
  3. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. TTL Uarts ≥1 5 items
  2. TTL Uarts ≥2 6 items
  3. TTL Uarts ≥3 4 items
USB
  1. USB 2.0 ≥ 1 6 items
  2. USB 2.0 ≥ 2 6 items
  3. USB 2.0 ≥ 3 4 items
  4. USB 2.0 ≥ 4 5 items
  5. USB 2.0 ≥ 5 3 items
  6. USB 3.0 ≥ 1 4 items
  7. USB 3.0 ≥ 2 3 items
  8. USB 3.1 ≥ 1 1 item
  9. USB 3.2 ≥ 2 1 item
  10. USB 4.0 ≥ 4 1 item
  11. USB OTG 4 items
Video Interfaces
  1. DDI 1 item
  2. DP 1 item
  3. DP++ 1 item
  4. DUAL CHANNEL LVDS 5 items
  5. eDP 4 items
  6. HDMI 5 items
  7. MIPI-CSI camera conn 1 item
  8. MIPI-DSI 3 items
  9. SINGLE CHANNEL LVDS 6 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 4 items
  2. ONBOARD WI-FI/BLE 8 items
  3. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 item
  4. /s/n/snapdragon-x_per_sito.jpg 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®