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COM Express®
COM-HPC®
Qseven®
SMARC®
Myon MicroModule (SOM)
Trizeps SODIMM (SOM)
ETX®

Computer on Module

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  1. Mass Storage
    onboard eMMC
  2. Video Interfaces
    eDP
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Shopping Options
Cpu Maker
  1. Qualcomm 2 items
  2. Rockchip 1 item
Cpu Type
  1. Qualcomm® QCS5430 1 item
  2. Qualcomm® QCS6490 1 item
  3. Rockchip RK3588 1 item
Ethernet
  1. ETHERNET≥1 3 items
  2. ETHERNET≥2 2 items
Form Factor
  1. COM Express® 1 item
  2. SMARC 2 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. ≤ 100 x 100mm 2 items
Form Factor Specification
  1. COM Express Basic 1 item
Memory
  1. memory ≤1 2 items
  2. memory ≤2 2 items
  3. memory ≤4 2 items
  4. memory ≤8 2 items
  5. memory ≥32 1 item
  6. soldered down 2 items
Mass Storage
  1. soldered down 1 item
  2. CFAST slot 1 item
  3. M.2 NVMe SSD slot 5 items
  4. M.2 SATA SSD slot 3 items
  5. microSD card slot 4 items
  6. onboard eMMC 17 items
  7. onboard eMMC 3 items
  8. SATA channels ≥ 1 19 items
  9. SATA channels ≥ 1 1 item
  10. SATA channels ≥ 2 1 item
  11. SATA channels ≥ 2 4 items
  12. SATA channels ≥ 2 16 items
  13. SATA channels ≥ 3 3 items
  14. SATA channels ≥ 4 1 item
  15. SD interface 6 items
  16. SD interface 2 items
  17. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. -40°C ÷ +85°C 1 item
  3. 0°C ÷ +50°C 2 items
  4. 0°C ÷ +60°C 3 items
  5. 20°C ÷ +70°C 2 items
  6. -20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 2 items
  3. PCI-e lanes ≥ 4 1 item
Ttl Uarts
  1. TTL Uarts ≥1 2 items
  2. TTL Uarts ≥2 3 items
USB
  1. USB 2.0 ≥ 1 3 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 2 items
  5. USB 3.1 ≥ 1 2 items
  6. USB CLIENT 1 item
Video Interfaces
  1. DP 3 items
  2. DUAL CHANNEL LVDS 2 items
  3. eDP 3 items
  4. HDMI 1 item
  5. MIPI-CSI camera conn 1 item
  6. MIPI-DSI 2 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 items
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®