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COM Express®
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Qseven®
SMARC®
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  1. Form Factor Specification
    µQseven 70x40
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Cpu Maker
  1. Intel 1 item
  2. NXP 3 items
Cpu Power Consumption
  1. range < 10 W 3 items
Cpu Type
  1. Intel® Atom™ 1 item
  2. Intel® Celeron® 1 item
  3. NXP i.MX 8M Mini 1 item
  4. NXP i.MX 8M Nano 1 item
  5. NXP i.MX6 2 items
Ethernet
  1. ETHERNET≥1 3 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. 40x70 mm (µQseven, 1.57"x 2.76") 3 items
  3. ≤ 100 x 100mm 2 items
  4. ≤ 80 x 80mm 2 items
Form Factor Specification
  1. COM Express Basic 8 items
  2. COM Express Compact 13 items
  3. COM-HPC Client 4 items
  4. Qseven 70x70 mm 7 items
  5. µQseven 70x40 4 items
Memory
  1. memory ≤1 4 items
  2. memory ≤2 3 items
  3. memory ≤4 2 items
  4. soldered down 3 items
Mass Storage
  1. onboard eMMC 4 items
  2. SATA channels ≥ 1 1 item
  3. SATA channels ≥ 2 1 item
  4. SD interface 4 items
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. -40°C ÷ +85°C 2 items
  3. 0°C ÷ +50°C 3 items
  4. 0°C ÷ +60°C 4 items
  5. 20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 4 items
  2. PCI-e lanes ≥ 2 1 item
  3. PCI-e lanes ≥ 3 1 item
Ttl Uarts
  1. TTL Uarts ≥1 3 items
  2. TTL Uarts ≥2 2 items
USB
  1. USB 2.0 ≥ 1 4 items
  2. USB 2.0 ≥ 2 3 items
  3. USB 2.0 ≥ 3 3 items
  4. USB 2.0 ≥ 4 3 items
  5. USB 2.0 ≥ 5 1 item
  6. USB 3.0 ≥ 1 1 item
  7. USB OTG 2 items
Video Interfaces
  1. DP++ 1 item
  2. DUAL CHANNEL LVDS 3 items
  3. eDP 1 item
  4. HDMI 2 items
  5. SINGLE CHANNEL LVDS 3 items
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®