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COM Express®
COM-HPC®
Qseven®
SMARC®
Myon MicroModule (SOM)
Trizeps SODIMM (SOM)
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Computer on Module

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  1. Form Factor Dimensions
    COM Express®
  2. Operating Temperature
    -40°C ÷ +85°C
  3. Video Interfaces
    DP
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Shopping Options
Cpu Maker
  1. Intel 1 item
  2. Qualcomm 1 item
Cpu Power Consumption
  1. range > 25 W 1 item
Cpu Type
  1. Intel® Core™ 1 item
  2. Qualcomm Dragonwing 1 item
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. ≤ 100 x 100mm 12 items
  3. ≤ 80 x 80mm 3 items
  4. ≥ 100 x 100mm 1 item
  5. COM Express® 2 items
Form Factor Specification
  1. COM Express Basic 1 item
  2. COM Express Compact 1 item
Memory
  1. memory ≥32 1 item
  2. soldered down 1 item
  3. SO_DIMM 1 item
  4. UFS 3.1 module on-board 1 item
  5. I2C EEPROM 1 item
Mass Storage
  1. soldered down 1 item
  2. M.2 NVMe SSD slot 1 item
  3. SATA channels ≥ 2 1 item
  4. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -40°C ÷ +85°C 2 items
  2. 0°C ÷ +50°C 1 item
  3. 0°C ÷ +60°C 3 items
USB
  1. USB 2.0 ≥ 6 2 items
  2. USB 3.0 ≥ 4 1 item
  3. USB 3.2 ≥ 2 1 item
  4. USB 4.0 ≥ 2 1 item
Video Interfaces
  1. DDI 1 item
  2. DP 2 items
  3. DUAL CHANNEL LVDS 2 items
  4. eDP 2 items
  5. HDMI 1 item
  6. MIPI-CSI camera conn 1 item
  7. SINGLE CHANNEL LVDS 2 items
  8. VGA 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®