SOM-COMe-BT6-RPL-P
Détails produit
Description | COM Express® 3.1 Type 6 Basic Computer on Module (CoM) with 13th Gen Intel® Core™ processors (formerly codenamed Raptor Lake-P) |
---|---|
Cpu | 13th Gen Intel® Core™ processors (Raptor Lake U/P/H series) and Intel® Processor U300E:
|
Mémoire | Two DDR5 SO-DIMM slots supporting DDR5-4800, IBECC modules memory, up to 64GB |
Graphiques | Intel® UHD Graphics/Intel® Iris® Xe Graphics architecture, up to 96 EU Improved image (IPU6EP) and video processing (AV1/GNA 3.0) Support up to 4 independent displays @ 4K |
Interfaces vidéo | Up to 3x Digital Display Interfaces (DDIs), supporting DVI, DP 1.4, HDMI 2.1 1x VGA (factory option) 1x eDP 1.3 or single/dual-channel 18-/24-bit LVDS interface (factory alternatives) |
Résolution vidéo | HDMI and DP up to 8K @ 60Hz via TCSS with Hayden Bridge eDP 1.4b up to 5K @ 120Hz (HBR3 with VDSC1.1) LVDS up to 1920x1200 @ 60Hz |
Stockage masse | 2x SATA Gen3 channels Up to 128 GB on-board NVMe SSD (factory alternative to one PCI-express Graphics (PEG) x4 Gen4) |
Réseau | 1x NBase-T Ethernet interface with Intel® I225 GbE controller, with TSN and 2.5GbE supported. |
Usb | Up to 2x USB 4 Gen2 host ports (depending on carrier board retimer implementation) 4x USB 3.2 Gen2 (10Gbps) host ports (depending on carrier board retimer implementation) 8x USB 2.0 host ports |
Pci | Up to 8x PCI-e x1 Gen3 lanes 1x PCI-express Graphics (PEG) x8 Gen4 Up to 2x PCI-express Graphics (PEG) x4 Gen4 |
Audio | HD audio and Soundwire/i2S audio interfaces |
Ports sériels | 2x UARTs |
Autres Interfaces | SPI, I2C, SM Bus, Thermal Management, FAN management Optional eSPI or LPC bus (factory alternatives) Optional TPM 2.0 on-board LID#/SLEEP#/PWRBTN#, Watchdog 4 x GPI, 4 x GPO |
Alimentation | 8VDC..20VDC, +5VSB (optional), +3VRTC (optional) |
Système d’exploitation | Microsoft® Windows 10 Linux Ubuntu |
Température de fonctionnement | 0°C to +60°C (commercial version)* -40°C to +85°C (industrial version)*
*Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
Dimensions | 125 x 95 mm (COM Express® Basic Form factor, Type 6 pinout) |
Vous n'avez pas trouvé la solution que vous cherchez?
Le produit standard ne répond pas à vos besoins? SECO est à votre disposition pour développer ensemble une solution hardware et logicielle partiellement ou entièrement personnalisée.
En savoir plus