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COM Express®
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  1. Form Factor Dimensions
    ≤ 100 x 100mm
  2. Form Factor Specification
    µQseven 70x40
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Cpu Maker
  1. Intel 1 item
  2. NXP 1 item
Cpu Type
  1. Intel® Atom™ 1 item
  2. Intel® Celeron® 1 item
  3. NXP i.MX 8M Mini 1 item
  4. NXP i.MX 8M Nano 1 item
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. 40x70 mm (µQseven, 1.57"x 2.76") 3 items
  3. ≤ 100 x 100mm 2 items
  4. ≤ 80 x 80mm 2 items
Form Factor Specification
  1. COM Express Compact 12 items
  2. Qseven 70x70 mm 6 items
  3. µQseven 70x40 2 items
Memory
  1. memory ≤1 2 items
  2. memory ≤2 2 items
  3. memory ≤4 2 items
  4. soldered down 2 items
Mass Storage
  1. onboard eMMC 2 items
  2. SATA channels ≥ 1 1 item
  3. SATA channels ≥ 2 1 item
  4. SD interface 2 items
Operating Temperature
  1. -20°C ÷ +60°C 1 item
  2. 0°C ÷ +50°C 2 items
  3. 0°C ÷ +60°C 2 items
  4. 20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 1 item
  3. PCI-e lanes ≥ 3 1 item
Ttl Uarts
  1. TTL Uarts ≥1 2 items
  2. TTL Uarts ≥2 1 item
USB
  1. USB 2.0 ≥ 1 2 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 2 items
  5. USB 2.0 ≥ 5 1 item
  6. USB 3.0 ≥ 1 1 item
Video Interfaces
  1. DP++ 1 item
  2. DUAL CHANNEL LVDS 1 item
  3. eDP 1 item
  4. SINGLE CHANNEL LVDS 2 items
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®