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Computer on Module
COM Express®
COM-HPC®
Qseven®
SMARC®
Myon MicroModule (SOM)
Trizeps SODIMM (SOM)
ETX®

Computer on Module

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  1. Cpu Power Consumption
    range < 5 W
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Cpu Maker
  1. NXP 5 items
  2. Qualcomm 1 item
Cpu Power Consumption
  1. range 10-25 W 17 items
  2. range < 10 W 17 items
  3. range < 5 W 6 items
  4. range > 25 W 8 items
Cpu Type
  1. NXP i.MX 8M 1 item
  2. NXP i.MX 8M Mini 2 items
  3. NXP i.MX 8M Nano 1 item
  4. NXP i.MX 8M Plus 1 item
  5. NXP i.MX6 1 item
  6. Qualcomm Snapdragon 1 item
Ethernet
  1. ETHERNET≥1 6 items
  2. ETHERNET≥2 1 item
Form Factor
  1. Myon MicroModule SOM 2 items
  2. Trizeps SODIMM SOM 4 items
Form Factor Dimensions
  1. 48,5 x 32,5 mm 2 items
  2. 67,6 x 36,7 mm 4 items
Memory
  1. memory ≤1 6 items
  2. memory ≤2 6 items
  3. memory ≤4 4 items
  4. memory ≤8 4 items
Operating Temperature
  1. -40°C ÷ +85°C 5 items
Pci Express
  1. PCI-e lanes ≥ 1 1 item
Ttl Uarts
  1. TTL Uarts ≥1 5 items
  2. TTL Uarts ≥2 5 items
  3. TTL Uarts ≥3 5 items
USB
  1. USB 2.0 ≥ 1 3 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 3.0 ≥ 1 2 items
  4. USB 3.0 ≥ 2 2 items
  5. USB OTG 3 items
Video Interfaces
  1. DUAL CHANNEL LVDS 2 items
  2. HDMI 1 item
  3. MIPI-DSI 5 items
  4. PARALLEL RGB 3 items
  5. SINGLE CHANNEL LVDS 3 items
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®