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COM Express®
COM-HPC®
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Computer on Module

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  1. Cpu Maker
    Qualcomm
  2. Operating Temperature
    -40°C ÷ +85°C
  3. Ttl Uarts
    TTL Uarts ≥2
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Cpu Maker
  1. AMD 5 items
  2. Intel 13 items
  3. MediaTek 3 items
  4. NXP 12 items
  5. Qualcomm 2 items
  6. Rockchip 1 item
Cpu Type
  1. Qualcomm Dragonwing IQ9 1 item
Ethernet
  1. ETHERNET≥1 1 item
  2. ETHERNET≥2 1 item
Form Factor
  1. COM Express® 1 item
  2. COM-HPC® 1 item
Form Factor Dimensions
  1. COM Express® 1 item
Form Factor Specification
  1. COM Express Compact 1 item
Memory
  1. soldered down 2 items
  2. UFS 3.1 module on-board 1 item
  3. I2C EEPROM 1 item
Mass Storage
  1. soldered down 1 item
  2. M.2 NVMe SSD slot 1 item
  3. SATA channels ≥ 2 1 item
  4. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. -40°C ÷ +85°C 2 items
  3. 0°C ÷ +50°C 2 items
  4. 0°C ÷ +60°C 4 items
  5. 20°C ÷ +70°C 2 items
  6. -20°C ÷ +70°C 2 items
Ttl Uarts
  1. TTL Uarts ≥2 2 items
  2. TTL Uarts ≥3 1 item
USB
  1. USB 2.0 ≥ 4 1 item
  2. USB 2.0 ≥ 6 1 item
  3. USB 3.0 ≥ 4 1 item
Video Interfaces
  1. DDI 1 item
  2. DP 2 items
  3. DUAL CHANNEL LVDS 1 item
  4. eDP 2 items
  5. MIPI-CSI camera conn 2 items
  6. SINGLE CHANNEL LVDS 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®