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SOM-COMe-CT6-ASL
COM Express® 3.1 Type 6 Compact Module with Intel Atom® Processors x7000E Series (Codename: Amston Lake and Alder Lake N)
Available in Industrial Temperature Range
Cpu
Intel® Atom® Processors x7000E Series, Intel® Processor N series and Intel® Core™ i3 N305 Processor
Gráficas
Integrated Intel® Gen12 UHD graphics controller with up to 32 EU
Conectividad
1x NBase-T 2.5GbE; up to 2x USB 10Gbps + 3x USB 5Gbps; 8x Hi-Speed USB; 6x PCI-e lanes Gen3
Memoria
One SO-DIMM slot supporting DDR5-4800 IBECC memory, up to 16GB
Datos del producto
Descripción
|
COM Express® 3.1 Type 6 Compact Module with Intel Atom® Processors x7000E Series (Codename: Amston Lake and Alder Lake N) |
|---|---|
Cpu
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Intel® Atom® Processors x7000RE (Codename: Amston Lake) Series:
Intel Atom® Processors x7000E (Codename: Alder Lake N) Embedded E Series:
Intel® Core™ i3 Processors and Intel® Processor N Series (Codename: Alder Lake N) PC Client Processors
(*) TCC: Time Coordinated Computing |
|
Memoria
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One DDR5 SO-DIMM slot supporting DDR5-4800 IBECC modules, up to 16GB
|
|
Gráfica
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Integrated Intel® Gen12 UHD graphics controller with up to 32 EU |
Interfaces vídeos
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2x Digital Display Interfaces (DDIs), supporting DP, HDMI®, DP Alt-Mode over Type-C |
Resolución vídeo
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HDMI®: up to 4Kx2K @60Hz according to HDMI 2.0b |
Almacenamiento en masa
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Up to 2x S-ATA Gen3 channels |
Trabajo en red
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1x NBase-T Ethernet interface with MaxLinear GPY211/215 GbE controller, supporting 2.5GbE and TSN |
Usb
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Up to 2x USB 10Gbps |
|
Pci
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Up to 6x PCI-e Gen3 lanes |
Audio
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HD Audio interface |
Puertos de serie
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2x UARTs |
Otras interfaces
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SPI, 2x I2C, SM Bus, Thermal Management, FAN management |
Alimentación eléctrica
|
+12VDC ± 10%, +5VSB (optional), +3VRTC (optional) |
Sistema operativo
|
Microsoft® Windows 10 IoT Enterprise 2019 LTSC |
Temperatura de funcionamiento
|
0°C ÷ +60°C (Commercial version)
* Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
Dimensiones
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95 x 95 mm (COM Express® Compact Form factor, Type 6 pinout) |
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