SOM-COM-HPC-A-TGL-H

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SOM-COM-HPC-A-TGL-H

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Módulo cliente COM-HPC® de tamaño A con procesadores Intel® Xeon® de 11.ª generación de la serie W-11000E, Core™ vPro® y Celeron® (Codename: Tiger Lake-H) para aplicaciones FuSa. (LAGOON - D57)

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Manual

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Centro de desarrollo

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Clea OS

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Aspectos destacados

CPU11th Gen Intel® Xeon®, Core™ and Celeron® processors

GraphicsIntel® Iris Xe Graphics Core Gen12 GPU with up to 32 EU, up to 4 independent displays

MemoryTwo DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory

Security & Compliance by Design

SECO products integrate security functions that enable out-of-the-box compliance with the RED directive [EN18031-1]. Certification documentation is available upon request. Security monitoring, patching and update automation are powered by Clea.

Secure Boot

Built-in Secure Boot to ensure system integrity from the first startup.

OTA Updates

Remote and secure software update distribution for your devices.

Device Monitoring

Continuous monitoring of device status and activity with Clea.

Secure Operating System

Yocto-based OS integration for customizable and secure system builds.

Certified Security

Compliance with EN18031-1 standards for secure and reliable embedded systems.

Docker Technology

Isolated and flexible application management through containerization.

Applications Hub

Descubre las aplicaciones compatibles con este producto disponibles en SECO Application Hub: soluciones listas para usar para acelerar el desarrollo e implementación de funciones inteligentes.

Machine Alert Assistance with Operator Recognition

HMI system that uses AI to recognize operators during alerts and show personalized troubleshooting instructions.

Industrial Safety Surveillance

People Counter

Lightweight real-time people counting model based on quantized YOLOX, optimized for edge devices using LiteRT (TensorFlow Lite) .

Industrial Safety Surveillance

PoseNet for Multi-Person Pose Detection

Lightweight and quantized PoseNet model for real-time multi-person pose estimation on edge hardware.

Industrial Safety Surveillance

HRNet for Human Pose Estimation

High-resolution neural network for accurate keypoint detection in human pose estimation tasks.

Industrial Safety Surveillance

Especificaciones técnicas

Descripción	Módulo cliente COM-HPC® de tamaño A con procesadores Intel® Xeon® de 11.ª generación de la serie W-11000E, Core™ vPro® y Celeron® (antes Tiger Lake-H) para aplicaciones FuSa
CPU Description	11th Generation Intel® Xeon®, Core™ and Celeron® Processors, also available in industrial temperature range. • Intel® Core™ vPRO® i7-11850HE, Eight Core @ 2.6GHz (up to 4.7GHz in Turbo Boost) with HT, 24MB Cache L3, 45/35W cTDP • Intel® Core™ vPRO® i5-11500HE, Six Core @ 2.6GHz (up to 4.5GHz in Turbo Boost) with HT, 12MB L3 Cache, 45/35W cTDP • Intel® Core™ i3-11100HE, Quad Core @ 2.4GHz (up to 4.4GHz in Turbo Boost) with HT, 8MB L3 Cache, 45/35W cTDP • Intel® Celeron® 6600HE, Dual Core @2.6GHz, 8MB L3 Cache, 35W TDP • Intel® Xeon® vPRO® W-11865MRE, Eight Core @ 2.6GHz (up to 4.7GHz in Turbo Boost) with HT, 24MB L3 Cache, with ECC, TCC/TSN and Functional Safety Essential Design package, 45/35W cTDP – Industrial (w/ Turbo OFF) • Intel® Xeon® vPRO® W-11555MRE, Six Core @ 2.6GHz (up to 4.5GHz in Turbo Boost) with HT, 12MB L3 Cache, with ECC, TCC/TSN and Functional Safety Essential Design package, 45/35W cTDP – Industrial (w/ Turbo OFF) • Intel® Xeon® W-11155MRE, Quad Core @ 2.4GHz (up to 4.4GHz in Turbo Boost) with HT, 8MB L3 Cache, with ECC and TCC/TSN, 45/35W cTDP – Industrial (w/ Turbo OFF) • Intel® Xeon® vPRO® W-11865MLE, Eight Core @ 1.5GHz (up to 4.5GHz in Turbo Boost) with HT, 24MB L3 Cache, with ECC and TCC/TSN, 25W TDP • Intel® Xeon® vPRO® W-11555MLE, Six Core @ 1.9GHz (up to 4.4GHz in Turbo Boost) with HT, 24MB L3 Cache, with ECC and TCC/TSN, 25W TDP • Intel® Xeon® W-11155MLE, Quad Core @ 1.8GHz (up to 3.1GHz in Turbo Boost) with HT, 24MB L3 Cache, with ECC and TCC/TSN, 25W TDP B Cache, 28/15/12W cTDP - Industrial (w/ Turbo OFF)
Max Cores	8
Memory Description	2x DDR4-3200 SODIMM Slots with ECC (In-Band Error Correction Code), up to 64GB supported
Graphics Description	Integrated Iris Xe Graphics Core Gen12 architecture, with up to 32 Execution Units and up to 2 VDbox MPEG2, WMV9, AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP9, AV1 HW decoding, up to 8k60. AVC/H.264, HEVC/H.265, JPEG, VP9 HW encoding, up to 8k30 Support up to 4 independent displays.
Video Interfaces Description	1x eDP 1.4b or MIPI_DSI 1.3 Up to 3x DP++ interface, supporting Display Port 1.4a and HDMI 2.0b Up to 2x Display Port over Type-C (Alternate mode)
Video Resolution Description	DP, eDP: Up to 5120x3200 @60Hz 24bpp / 7680x4320@60Hz 30bpp with DSC MIPI-DSI: Up to 3200x2000 @60Hz 24bpp, 5120x3200 @60Hz 24bpp with DSC HDMI 1.4: Up to 4Kx2K 24-30Hz 24bpp HDMI 2.0b: Up to 4Kx2K 48-60Hz 24bpp / 4Kx2K 48- 60Hz 12bpc (need dedicated redriver on carrier board)
Mass Storage Description	2 x S-ATA Gen3 Channels PCI-e x4 port can be used to connect, on the carrier board, M.2 NVMe drives
Networking Description	Up to 2x NBase-T Ethernet interfaces, supporting 2.5Gb Ethernet connection, managed by as many Intel® i225 2.5GbE Controllers with TSN
USB Description	2x USB4 ports 2x USB 3.2 Gen 2x2 ports 8 x USB 2.0 Host ports
PCI Description	1x PCI-e x4 Gen 4 port for NVME 16x PCI-e Gen4 lanes, can be used to support 1x PCI-e x16, 2x PCI-e x8 or (1x PCI-e x8 +2x PCI-e x4) root ports 20x PCI-e Gen 3 lanes, groupable to support up to 12 root ports, max allowed grouping PCI-e x4
Audio Description	SoundWire and I2S Audio Interface
Serial Ports	2x legacy UARTs, managed by the Embedded Controller
Other Interfaces	2x 4-lane CSI-2 interfaces, optional SPI, eSPI, SM Bus, 2x I2C, Watchdog timer, Carrier board FAN Control Management signals, ACPI signals, Safety Status signals Deep Sleep / Battery support Optional TPM 2.0 module on-board 12x GPIOs
Power Supply	+8VDC .. +20VDC Main power supply +5V stand-by
Operating System	Windows 10 IoT Enterprise LTSC Linux Kernel LTS Yocto Project 3.0 WindRiver VxWorks 7.0 Android
Operating Temperature Description	0°C ÷ +60°C (Commercial version) -40°C ÷ +85°C (Industrial Range)
Dimensions	120 x 95 mm (COM-HPC® Size A Form factor, Client pinout)

Número de parte

HD57-4100-0120-C1

COM HPC Client Size A w/ Intel® Tiger Lake H 6600H, PCH-H 500 HM570E , 4wire FAN, TPM SLB 9670 Q2.0 - Comm. Temp.

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HD57-5300-0120-I1

COM HPC Client Size A w/ Intel® Tiger Lake H W-11865MRE, PCH-H 500 RM590E , 4wire FAN, TPM SLB 9670 Q2.0 - Ind. Temp.

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HD57-6300-0120-I1

COM HPC Client Size A w/ Intel® Tiger Lake H W-11555MRE, PCH-H 500 RM590E , 4wire FAN, TPM SLB 9670 Q2.0 - Ind. Temp.

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Accessories

DEV-KIT-COM-HPC-A

Características técnicas

Cross Platform Development Kit compatible with both x86 and ARM COM-HPC Client modules

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Recursos

Hoja de datos	[Datasheet] SOM-COM-HPC-A-TGL-H Rel. 1.0
Manual	[Manual] SOM-COMHPC-A-TGL-H Manual
Imagen	[Picture] LAGOON_front [Picture] LAGOON_back
Documentación	Documentation
Clea	Clea

SOM-COM-HPC-A-TGL-H

Hoja de datos

Manual

Centro de desarrollo

Clea OS

Aspectos destacados

Security & Compliance by Design

Secure Boot

OTA Updates

Device Monitoring

Secure Operating System

Certified Security

Docker Technology

Applications Hub

Machine Alert Assistance with Operator Recognition

People Counter

PoseNet for Multi-Person Pose Detection

HRNet for Human Pose Estimation

Número de parte

Accessories

DEV-KIT-COM-HPC-A

Productos relacionados

HD57-DISS-3-PK

Recursos