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COM Express® 3.1 Type 6 Compact Module with Qualcomm Dragonwing™ IQ9 Processors. (F99)
COM Express® 3.1 Type 6 Compact Module with AMD Ryzen™ AI Embedded P100 Series. (F45)
COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H). (F36)
COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)
COM Express® Rel. Módulo 3.0 Compact Tipo 6 con procesadores Intel® Core™ y Celeron™ de 8.ª generación de la serie U (Codename: Whiskey Lake-U) Processors. (LARISSA - C55)