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COM Express®
COM-HPC®
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SMARC®
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  1. Ttl Uarts
    TTL Uarts ≥3
  2. Video Interfaces
    DP
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Shopping Options
Cpu Maker
  1. AMD 1 item
  2. MediaTek 1 item
  3. Qualcomm 1 item
Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range < 10 W 1 item
Cpu Type
  1. MediaTek Genio 510 1 item
  2. Zynq® Ultras 1 item
  3. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 2 items
  2. ETHERNET≥2 2 items
Form Factor Dimensions
  1. ≤ 100 x 100mm 3 items
  2. ≤ 80 x 80mm 1 item
Memory
  1. memory ≤1 2 items
  2. memory ≤2 2 items
  3. memory ≤4 2 items
  4. memory ≤8 2 items
  5. soldered down 3 items
  6. memory ≤32 1 item
Mass Storage
  1. onboard eMMC 2 items
  2. SATA channels ≥ 1 1 item
  3. SD interface 1 item
  4. SD interface 1 item
  5. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. -20°C ÷ +70°C 1 item
  3. -40°C ÷ +85°C 3 items
  4. 0°C ÷ +50°C 2 items
  5. 0°C ÷ +60°C 3 items
  6. 20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 1 item
  2. PCI-e lanes ≥ 2 1 item
  3. PCI-e lanes ≥ 3 1 item
  4. PCI-e lanes ≥ 4 2 items
Ttl Uarts
  1. TTL Uarts ≥1 17 items
  2. TTL Uarts ≥2 20 items
  3. TTL Uarts ≥3 3 items
USB
  1. USB 2.0 ≥ 1 2 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 1 item
  5. USB 2.0 ≥ 5 2 items
  6. USB 3.0 ≥ 1 1 item
  7. USB 3.0 ≥ 2 2 items
  8. USB 3.1 ≥ 1 1 item
  9. USB OTG 1 item
Video Interfaces
  1. DP 3 items
  2. DP++ 1 item
  3. DUAL CHANNEL LVDS 8 items
  4. eDP 3 items
  5. HDMI 5 items
  6. MIPI-CSI camera conn 3 items
  7. MIPI-DSI 9 items
  8. PARALLEL RGB 3 items
  9. SINGLE CHANNEL LVDS 9 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®