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Computer on Module
COM Express®
COM-HPC®
Qseven®
SMARC®
Myon MicroModule (SOM)
Trizeps SODIMM (SOM)
ETX®

Computer on Module

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  1. Operating Temperature
    -40°C ÷ +85°C
  2. Video Interfaces
    MIPI-CSI camera conn
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Shopping Options
Cpu Maker
  1. Intel 2 items
  2. NXP 2 items
  3. Qualcomm 2 items
Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range < 10 W 3 items
Cpu Type
  1. Intel® Atom™ 2 items
  2. Intel® Celeron® 1 item
  3. Intel® Pentium® 1 item
  4. NXP i.MX 8M 1 item
  5. NXP i.MX6 1 item
  6. Qualcomm Dragonwing 1 item
  7. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 5 items
  2. ETHERNET≥2 3 items
Form Factor
  1. COM Express® 1 item
  2. Qseven 1 item
  3. SMARC 4 items
Form Factor Dimensions
  1. ≤ 100 x 100mm 5 items
  2. ≤ 80 x 80mm 3 items
  3. COM Express® 1 item
Form Factor Specification
  1. COM Express Compact 1 item
  2. Qseven 70x70 mm 1 item
Memory
  1. memory ≤1 4 items
  2. memory ≤16 1 item
  3. memory ≤2 4 items
  4. memory ≤4 4 items
  5. memory ≤8 2 items
  6. soldered down 6 items
  7. memory ≤32 1 item
  8. UFS 3.1 module on-board 1 item
  9. I2C EEPROM 1 item
Mass Storage
  1. onboard SSD 1 item
  2. soldered down 1 item
  3. microSD card slot 1 item
  4. onboard eMMC 4 items
  5. SATA channels ≥ 1 3 items
  6. SD interface 3 items
  7. SD interface 1 item
  8. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 2 items
Operating Temperature
  1. -20°C ÷ +60°C 4 items
  2. -40°C ÷ +85°C 6 items
  3. 0°C ÷ +50°C 5 items
  4. 0°C ÷ +60°C 11 items
  5. 20°C ÷ +70°C 4 items
  6. -20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 4 items
  2. PCI-e lanes ≥ 2 3 items
  3. PCI-e lanes ≥ 3 2 items
  4. PCI-e lanes ≥ 4 3 items
  5. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. TTL Uarts ≥1 4 items
  2. TTL Uarts ≥2 5 items
  3. TTL Uarts ≥3 3 items
USB
  1. USB 2.0 ≥ 1 4 items
  2. USB 2.0 ≥ 2 4 items
  3. USB 2.0 ≥ 3 3 items
  4. USB 2.0 ≥ 4 3 items
  5. USB 2.0 ≥ 5 3 items
  6. USB 2.0 ≥ 6 3 items
  7. USB 3.0 ≥ 1 2 items
  8. USB 3.0 ≥ 2 3 items
  9. USB 3.0 ≥ 4 1 item
  10. USB 3.2 ≥ 1 1 item
  11. USB 3.2 ≥ 2 1 item
  12. USB OTG 2 items
Video Interfaces
  1. DDI 10 items
  2. DP 16 items
  3. DP++ 9 items
  4. DUAL CHANNEL LVDS 27 items
  5. eDP 23 items
  6. HDMI 27 items
  7. MIPI-CSI camera conn 6 items
  8. MIPI-DSI 10 items
  9. PARALLEL RGB 4 items
  10. SINGLE CHANNEL LVDS 26 items
  11. VGA 3 items
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®