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COM Express®
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SMARC®
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  1. Form Factor Dimensions
    COM Express®
  2. Operating Temperature
    0°C ÷ +50°C
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Cpu Maker
  1. Intel 1 item
  2. Qualcomm 1 item
Cpu Type
  1. Intel® Core™ 1 item
  2. Qualcomm Dragonwing IQ-X 1 item
Ethernet
  1. ETHERNET≥1 1 item
  2. ETHERNET≥2 1 item
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. 40x70 mm (µQseven, 1.57"x 2.76") 1 item
  3. ≤ 100 x 100mm 22 items
  4. ≤ 80 x 80mm 10 items
  5. ≥ 100 x 100mm 4 items
  6. COM Express® 2 items
Form Factor Specification
  1. COM Express Basic 1 item
Memory
  1. memory ≤1 1 item
  2. memory ≤16 1 item
  3. memory ≤2 1 item
  4. memory ≤4 1 item
  5. memory ≤8 1 item
  6. memory ≥32 1 item
  7. SO_DIMM 1 item
  8. I2C EEPROM 1 item
  9. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 item
Mass Storage
  1. I2C EEPROM 1 item
  2. M.2 NVMe SSD slot 1 item
  3. SATA channels ≥ 1 1 item
  4. SATA channels ≥ 2 1 item
  5. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 item
Operating Temperature
  1. -20°C ÷ +60°C 1 item
  2. -40°C ÷ +85°C 3 items
  3. 0°C ÷ +50°C 2 items
  4. 0°C ÷ +60°C 4 items
Pci Express
  1. PCI-e lanes ≥ 1 1 item
  2. PCI-e lanes ≥ 2 1 item
  3. PCI-e lanes ≥ 3 1 item
  4. PCI-e lanes ≥ 4 1 item
  5. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. TTL Uarts ≥1 1 item
  2. TTL Uarts ≥2 1 item
USB
  1. USB 2.0 ≥ 1 1 item
  2. USB 2.0 ≥ 2 1 item
  3. USB 2.0 ≥ 3 1 item
  4. USB 2.0 ≥ 4 1 item
  5. USB 2.0 ≥ 5 1 item
  6. USB 2.0 ≥ 6 1 item
  7. USB 3.0 ≥ 1 1 item
  8. USB 3.0 ≥ 2 1 item
  9. USB 3.0 ≥ 3 1 item
  10. USB 3.0 ≥ 4 1 item
Video Interfaces
  1. DDI 1 item
  2. DP 1 item
  3. DUAL CHANNEL LVDS 1 item
  4. eDP 1 item
  5. HDMI 1 item
  6. MIPI-CSI camera conn 1 item
  7. SINGLE CHANNEL LVDS 1 item
Wireless Connectivity
  1. /s/n/snapdragon-x_per_sito.jpg 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®