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COM Express®
COM-HPC®
Qseven®
SMARC®
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Trizeps SODIMM (SOM)
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  1. Cpu Maker
    AMD
  2. Ethernet
    ETHERNET≥2
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Cpu Maker
  1. AMD 2 items
  2. Intel 9 items
  3. NXP 5 items
  4. Qualcomm 4 items
Cpu Power Consumption
  1. range 10-25 W 2 items
  2. range < 10 W 1 item
  3. range > 25 W 1 item
Cpu Type
  1. AMD EPYC™ Embedded 3 1 item
  2. Zynq® Ultras 1 item
Ethernet
  1. ETHERNET≥1 6 items
  2. ETHERNET≥2 2 items
Form Factor
  1. COM Express® 1 item
  2. SMARC 1 item
Form Factor Dimensions
  1. ≤ 100 x 100mm 1 item
  2. ≤ 80 x 80mm 1 item
  3. ≥ 100 x 100mm 1 item
Form Factor Specification
  1. COM Express Basic 1 item
Memory
  1. memory ≤1 2 items
  2. memory ≤16 1 item
  3. memory ≤2 2 items
  4. memory ≤4 2 items
  5. memory ≤8 2 items
  6. memory ≥32 1 item
  7. soldered down 1 item
  8. SO_DIMM 1 item
Mass Storage
  1. onboard eMMC 1 item
  2. SATA channels ≥ 1 2 items
  3. SATA channels ≥ 2 1 item
  4. SD interface 1 item
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. -40°C ÷ +85°C 2 items
  3. 0°C ÷ +50°C 2 items
  4. 0°C ÷ +60°C 2 items
  5. 20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 2 items
  3. PCI-e lanes ≥ 3 2 items
  4. PCI-e lanes ≥ 4 2 items
  5. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. TTL Uarts ≥1 2 items
  2. TTL Uarts ≥2 2 items
  3. TTL Uarts ≥3 1 item
USB
  1. USB 2.0 ≥ 1 1 item
  2. USB 2.0 ≥ 2 1 item
  3. USB 2.0 ≥ 3 1 item
  4. USB 3.0 ≥ 1 1 item
  5. USB 3.0 ≥ 2 1 item
  6. USB 3.1 ≥ 1 1 item
  7. USB 3.1 ≥ 2 1 item
  8. USB OTG 1 item
Video Interfaces
  1. DP 1 item
  2. DUAL CHANNEL LVDS 1 item
  3. SINGLE CHANNEL LVDS 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®