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SOM-SMARC-Dragonwing-IQ8

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

/images/trizeps/som-trizeps-x-genio-front-main.jpg

SOM-Trizeps-X-Genio360

SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor. (F67)

/images/hmi/modular-vision-front-main-10-1.jpg

Modular Vision 10.1 MX95

Entry level 10.1 inch HMI based on NXP i.MX95

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)

Titan 225 RK3399

Titan 225 RK3399

Ordenador integrado sin ventilador basado en el procesador de aplicaciones Rockchip RK3399. (PICTOR - SYS-C31-IPC)

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  1. Pci Express
    PCI-e lanes ≥ 1
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    USB 3.0 ≥ 2
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Cpu Maker
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  2. NXP 4 items
  3. Raspberry Pi 1 item
Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range < 10 W 2 items
  3. range < 5 W 1 item
Cpu Type
  1. NXP i.MX 8M 2 items
  2. NXP i.MX 8M Plus 1 item
  3. NXP i.MX 8X 1 item
  4. Zynq® Ultras 1 item
Ethernet
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  2. ETHERNET≥2 3 items
Form Factor
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  2. Trizeps SODIMM SOM 1 item
  3. Modular HMIs 1 item
Form Factor Dimensions
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  2. ≤ 100 x 100mm 4 items
  3. ≤ 80 x 80mm 4 items
Memory
  1. memory ≤1 5 items
  2. memory ≤2 5 items
  3. memory ≤4 5 items
  4. memory ≤8 3 items
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Mounting Option
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Mass Storage
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  2. onboard eMMC 6 items
  3. SATA channels ≥ 1 1 item
  4. SD interface 4 items
Operating Temperature
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  2. -40°C ÷ +85°C 5 items
  3. 0°C ÷ +50°C 3 items
  4. 0°C ÷ +60°C 5 items
  5. 20°C ÷ +70°C 3 items
Pci Express
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  2. PCI-e lanes ≥ 2 2 items
  3. PCI-e lanes ≥ 3 1 item
  4. PCI-e lanes ≥ 4 2 items
Ttl Uarts
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USB
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  3. USB 2.0 ≥ 3 12 items
  4. USB 2.0 ≥ 4 9 items
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  5. MIPI-CSI camera conn 1 item
  6. MIPI-DSI 3 items
  7. PARALLEL RGB 1 item
  8. SINGLE CHANNEL LVDS 4 items
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 3 items