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SOM-SMARC-Dragonwing-IQ8

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

/images/trizeps/som-trizeps-x-genio-front-main.jpg

SOM-Trizeps-X-Genio360

SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor. (F67)

/images/hmi/modular-vision-front-main-10-1.jpg

Modular Vision 10.1 MX95

Entry level 10.1 inch HMI based on NXP i.MX95

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)

Titan 225 RK3399

Titan 225 RK3399

Ordenador integrado sin ventilador basado en el procesador de aplicaciones Rockchip RK3399. (PICTOR - SYS-C31-IPC)

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  1. Mass Storage
    SD interface
  2. Video Interfaces
    SINGLE CHANNEL LVDS
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Cpu Maker
  1. NXP 3 items
  2. Qualcomm 1 item
Cpu Type
  1. NXP i.MX 8M Mini 2 items
  2. NXP i.MX 8M Nano 1 item
  3. NXP i.MX6 1 item
  4. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 2 items
  2. ETHERNET≥2 2 items
Form Factor
  1. SMARC 1 item
  2. Single Board Computer 1 item
  3. Single Board Computer 2 items
Form Factor Dimensions
  1. ≤ 100 x 100mm 1 item
Form Factor Specification
  1. Other SBCs 3 items
Memory
  1. memory ≤1 3 items
  2. memory ≤2 1 item
  3. memory ≤4 1 item
  4. memory ≤8 1 item
  5. soldered down 1 item
  6. memory ≤32 1 item
Mass Storage
  1. onboard SSD 1 item
  2. microSD card slot 8 items
  3. onboard eMMC 2 items
  4. onboard eMMC 18 items
  5. onboard eMMC 4 items
  6. SATA channels ≥ 1 3 items
  7. SATA channels ≥ 2 1 item
  8. SD interface 9 items
  9. SD interface 4 items
  10. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -40°C ÷ +85°C 2 items
  2. 0°C ÷ +50°C 1 item
  3. 0°C ÷ +60°C 3 items
Pci Express
  1. PCI-e lanes ≥ 4 1 item
Ttl Uarts
  1. TTL Uarts ≥3 1 item
USB
  1. USB 2.0 ≥ 1 3 items
  2. USB 2.0 ≥ 2 3 items
  3. USB 2.0 ≥ 5 1 item
  4. USB 3.0 ≥ 2 1 item
  5. USB OTG 3 items
Video Interfaces
  1. DP 3 items
  2. DUAL CHANNEL LVDS 6 items
  3. eDP 2 items
  4. HDMI 3 items
  5. MIPI-CSI camera conn 3 items
  6. MIPI-DSI 3 items
  7. SINGLE CHANNEL LVDS 4 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
  2. M.2 SOCKET 2 KEY 1 item