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SOM-SMARC-Dragonwing-IQ8

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

/images/trizeps/som-trizeps-x-genio-front-main.jpg

SOM-Trizeps-X-Genio360

SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor. (F67)

/images/hmi/modular-vision-front-main-10-1.jpg

Modular Vision 10.1 MX95

Entry level 10.1 inch HMI based on NXP i.MX95

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)

Titan 225 RK3399

Titan 225 RK3399

Ordenador integrado sin ventilador basado en el procesador de aplicaciones Rockchip RK3399. (PICTOR - SYS-C31-IPC)

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Cpu Type
  1. NXP i.MX 8M Mini 1 item
  2. NXP i.MX 8M Nano 1 item
  3. NXP i.MX 95 1 item
  4. NXP i.MX6 4 items
  5. NXP i.MX8 1 item
Ethernet
  1. ETHERNET≥1 6 items
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Form Factor
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  3. Single Board Computer 4 items
Form Factor Dimensions
  1. ≤ 100 x 100mm 1 item
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Form Factor Specification
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InstallationDepth
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Memory
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  2. memory ≤16 1 item
  3. memory ≤2 2 items
  4. memory ≤4 2 items
  5. memory ≤8 2 items
Mass Storage
  1. onboard SSD 1 item
  2. microSD card slot 7 items
  3. onboard eMMC 1 item
  4. onboard eMMC 15 items
  5. onboard eMMC 7 items
  6. SATA channels ≥ 1 3 items
  7. SD interface 8 items
  8. SD interface 6 items
Operating Temperature
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  2. -40°C ÷ +85°C 2 items
  3. 0°C ÷ +50°C 4 items
  4. 0°C ÷ +60°C 6 items
  5. 20°C ÷ +70°C 1 item
  6. -20°C ÷ +70°C 1 item
Pci Express
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  2. PCI-e lanes ≥ 2 1 item
ScreenDimension
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  2. 1 item
Ttl Uarts
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USB
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  6. USB 2.0 ≥ 6 1 item
  7. USB 3.1 ≥ 1 3 items
  8. USB OTG 7 items
Video Interfaces
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  2. HDMI 3 items
  3. MIPI-CSI camera conn 1 item
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Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 items
  2. M.2 SOCKET 2 KEY 1 item