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SOM-SMARC-Dragonwing-IQ8

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

/images/trizeps/som-trizeps-x-genio-front-main.jpg

SOM-Trizeps-X-Genio360

SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor. (F67)

/images/hmi/modular-vision-front-main-10-1.jpg

Modular Vision 10.1 MX95

Entry level 10.1 inch HMI based on NXP i.MX95

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)

Titan 225 RK3399

Titan 225 RK3399

Ordenador integrado sin ventilador basado en el procesador de aplicaciones Rockchip RK3399. (PICTOR - SYS-C31-IPC)

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  1. Mass Storage
    SD interface
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Cpu Power Consumption
  1. range < 10 W 1 item
Cpu Type
  1. NXP i.MX 8M Mini 1 item
  2. NXP i.MX 8M Nano 1 item
  3. NXP i.MX 8X 1 item
Ethernet
  1. ETHERNET≥1 1 item
  2. ETHERNET≥2 1 item
Form Factor
  1. Qseven 1 item
  2. SMARC 1 item
Form Factor Dimensions
  1. 40x70 mm (µQseven, 1.57"x 2.76") 1 item
  2. ≤ 100 x 100mm 2 items
  3. ≤ 80 x 80mm 2 items
Form Factor Specification
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Memory
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  2. memory ≤2 2 items
  3. memory ≤4 2 items
  4. soldered down 2 items
Mass Storage
  1. microSD card slot 5 items
  2. onboard eMMC 9 items
  3. onboard eMMC 2 items
  4. SATA channels ≥ 2 1 item
  5. SD interface 2 items
  6. SD interface 2 items
Operating Temperature
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  2. -40°C ÷ +85°C 1 item
  3. 0°C ÷ +50°C 2 items
  4. 0°C ÷ +60°C 2 items
  5. 20°C ÷ +70°C 2 items
Ttl Uarts
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  3. TTL Uarts ≥3 1 item
USB
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  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 1 item
  5. USB 2.0 ≥ 5 1 item
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  7. USB 3.0 ≥ 2 1 item
Video Interfaces
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  5. MIPI-CSI camera conn 2 items
  6. MIPI-DSI 3 items
  7. SINGLE CHANNEL LVDS 9 items