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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H). (F36)

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Computadora embebida sin ventilador con los procesadores Intel® Core™ de 11ª generación y los Intel® Celeron® SoCs (Codename: Tiger Lake UP3) más el chip de inteligencia artificial Axelera: alimentado por un solo Metis AIPU de hasta 120 TOPS

SOM-SMARC-QCS6490

SOM-SMARC-QCS6490

SMARC® 2.1.1 module powered by Qualcomm Dragonwing™ QCS6490 processor. (E81)

SOM-SMARC-QCS5430

SOM-SMARC-QCS5430

SMARC® 2.1.1 module powered by Qualcomm Dragonwing™ QCS5430 processor. (E81)

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  1. Cpu Type
    Intel® Celeron®
  2. Memory
    SO_DIMM
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Cpu Type
  1. Intel® Celeron® 1 item
  2. Intel® Core™ 4 items
Ethernet
  1. ETHERNET≥1 1 item
  2. ETHERNET≥2 1 item
Memory
  1. memory ≤1 2 items
  2. memory ≤16 1 item
  3. memory ≤2 2 items
  4. memory ≤4 2 items
  5. memory ≤8 2 items
  6. memory ≥32 1 item
  7. soldered down 1 item
  8. SO_DIMM 1 item
USB
  1. USB 3.2 ≥ 1 1 item
  2. USB 3.2 ≥ 2 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
  2. M.2 SOCKET 2 KEY 1 item