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  1. Video Interfaces
    MIPI-DSI
  2. Wireless Connectivity
    ONBOARD WI-FI/BLE
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Cpu Maker
  1. NXP 3 items
  2. Qualcomm 2 items
Cpu Power Consumption
  1. range < 10 W 1 item
Cpu Type
  1. NXP i.MX 8M 1 item
  2. NXP i.MX 8X 1 item
  3. NXP i.MX 933/935 1 item
  4. Qualcomm Dragonwing IQ-2390 1 item
  5. Qualcomm Dragonwing IQ-2390 1 item
Ethernet
  1. ETHERNET≥1 4 items
  2. ETHERNET≥2 2 items
Form Factor
  1. SMARC 3 items
  2. Single Board Computer 2 items
Form Factor Dimensions
  1. ≤ 100 x 100mm 2 items
  2. ≤ 80 x 80mm 3 items
Memory
  1. memory ≤1 2 items
  2. memory ≤2 3 items
  3. memory ≤4 4 items
  4. soldered down 3 items
Mass Storage
  1. microSD card slot 2 items
  2. onboard eMMC 3 items
  3. onboard eMMC 2 items
  4. SD interface 3 items
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. -40°C ÷ +85°C 3 items
  3. 0°C ÷ +50°C 2 items
  4. 0°C ÷ +60°C 5 items
  5. 20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 1 item
Ttl Uarts
  1. TTL Uarts ≥1 4 items
  2. TTL Uarts ≥2 2 items
  3. TTL Uarts ≥3 3 items
USB
  1. USB 2.0 ≥ 1 4 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 1 item
  4. USB 2.0 ≥ 4 1 item
  5. USB 3.0 ≥ 1 2 items
  6. USB 3.0 ≥ 2 2 items
  7. USB 3.2 ≥ 1 2 items
  8. USB OTG 2 items
Video Interfaces
  1. DDI 1 item
  2. DP 3 items
  3. DP++ 3 items
  4. DUAL CHANNEL LVDS 12 items
  5. eDP 10 items
  6. HDMI 15 items
  7. MIPI-CSI camera conn 2 items
  8. MIPI-DSI 5 items
  9. PARALLEL RGB 2 items
  10. SINGLE CHANNEL LVDS 16 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 items
  2. ONBOARD WI-FI/BLE 5 items
Nuestros productos
  • Computer on Module
  • Single Board Computer (SBC)
  • Human Machine Interface
  • Fanless Embedded PCs
  • Industrial Embedded PCs
  • Payment Systems
  • Kits de desarrollo y accesorios
  • AI-Optimized Hardware
  • Evaluation Kit
  • Touch Display Solutions